Injection moulding of oxide reduced copper powders

Chan, Tsung Yu; Chuang, Min-Chen; Lin, Shun‐Tian

doi:10.1179/003258905x37710

Cited by 12 publications

(8 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…When compared to conventionally manufactured pure copper (8.9 g cm −3 ), this corresponds to 88.5 % or 93.3 %, respectively. While these two filaments reached a density comparable to state-of-the-art processes like metal injection molding (MIM) (about 95 % density [33]) or selective laser melting (about 95 % to 98 % density [34,35]), filaments F1 and F2 showed a significantly lower density after vacuum sintering (53.5 % for F1 and 63.4 % for F2). Only two filaments showed a significant improvement in the resulting density while using Ar during the thermal debinding and the forming gas mixture during sintering.…”

Section: Metal-fff On Specimen Scalementioning

confidence: 93%

Characterization of the Metal Fused Filament Fabrication Process for Manufacturing of Pure Copper Inductors

Schüßler,

Franke,

Czink

et al. 2023

Materials

View full text Add to dashboard Cite

This work presents a comprehensive investigation into the optimization of critical process parameters associated with metal fused filament fabrication (Metal-FFF) for the production of copper-based components. The study focused on three different commercial and one self-manufactured filament, each with unique chemical compositions. These filaments were systematically optimized and the density was characterized for all processing steps, as well as the electrical conductivity on the specimen scale. Remarkably, two of the studied filaments exhibited exceptional properties after sintering with forming gas (up to 94% density and 55.75 MS/m electrical conductivity), approaching the properties measured for established manufacturing methods like metal injection molding. Finally, the research was extended to component-scale applications, demonstrating the successful fabrication of inductors with integrated cooling channels. These components exhibited water tightness and were used in induction hardening experiments, validating the practical utility of the optimized Metal-FFF process. In summary, the results show great promise in advancing the utilization of Metal-FFF in industrial contexts, particularly in the production of high-performance copper components.

show abstract

Section: Metal-fff On Specimen Scalementioning

confidence: 93%

Characterization of the Metal Fused Filament Fabrication Process for Manufacturing of Pure Copper Inductors

Schüßler,

Franke,

Czink

et al. 2023

Materials

View full text Add to dashboard Cite

show abstract

“…However, by mixing, cross contamination should be avoided throughout the molding and maintain the higher thermal conductivities. 21) The injection molding was carried out with three different injection parameters as indicated in Table 2. This results in different material properties, as will be discussed later.…”

Section: Moldingmentioning

confidence: 99%

“…The adding of reactive dopants, for example, Al, Cr, and Si, can easily enable getter oxygen control, but, degrading the conductivity. 21,22) The removal of oxygen before the last-step pore closure will lead to around a 92% density, typically requiring nitrogen sintering along with properly planned thermal cycles. 23,24) 2.5 Thermal conductivity, electrical conductivity and CTE measurement The thermal measurement evaluation was carried out using the metaproperty measurement capabilities LFA 447 Nano flash (Netzsch).…”

Section: Debinding and Sinteringmentioning

confidence: 99%

Metal Injected Copper Carbon Nanotube Composite Material with High Thermal Conductivity and Low CTE for IGBT Power Modules

Mohammadi

Arab

2018

Mater. Trans.

View full text Add to dashboard Cite

Power modules, particularly in hybrid and electric vehicles, have become an essential part of their thermal management system design. In power cooling modules, the temperature variations are important issues, leading to thermal stresses caused by different coefficients of thermal expansion (CTE) in the composite materials. Thus, one should consider suitable materials and manufacturing processes to achieve the best performance and reliability during the device's life cycle. The Cu/CNT-Cu material is assumed to have a unique combination of a high thermal conductivity and low coefficient of thermal expansion, which results in a new composite material that goes beyond the ability of regular materials. To address this, we have developed the Cu/CNT-Cu composite with a significant improvement in thermal conductivity (³327 W/mK) which is within the industrial scale range of copper metal injection molding (320340 W/mK) and low coefficient of thermal expansion (³6 ppm/K), both of which make it an excellent choice for power modules in next generation automobiles. This was achieved by reducing the voids and increasing the interface bonding while adding the copper coated CNTs, which were made by an electroplating process. This mixed Cu/CNT-Cu property makes it the top material design selection in the Ashby map and has a better temperature stability due to its lower thermal distortion parameter (TDP). As a result, this material will represent a significant scientific and technological development in the advancement cooling of IGBT power module devices.

show abstract

“…Essentially, the cross contamination should be avoided during whole feedstock preparation process; otherwise, several defects will show up in the final part, and it will affect thermal conductivity. 24) The injection molding was carried out as shown in Fig. 3 with two different injection parameters as indicated in Table 2.…”

Section: Moldingmentioning

confidence: 99%

“…In order to eliminate further issues associated with water vapor, the oxygen amount in the sintering environment should be decreased. 24,25) Elimination of oxygen in the sintering would enhance pore closing that leads to near up to 92% density of the final part. Therefore, it usually needs nitrogen sintering along with properly planned thermal cycles.…”

Section: Debinding and Sinteringmentioning

confidence: 99%

Copper Like Thermal Conductivity and Silicon Like Coefficient of Thermal Expansion Copper Graphene for High Power IGBT by Metal Injection Molding

Mohammadi

2018

Mater. Trans.

View full text Add to dashboard Cite

Enhanced stability, lifetime and safety of high power IGBT (Insulated Gate Bipolar Transistor) modules are a result of their progressive material selection, thereby necessitating the invention of new composite materials. High-end power modules are operated close to the maximum physical matching capability of their layered materials, leading to decreased lifetime and degraded performance, and thus creating demand for new composite materials with higher thermal conductivity and lower coefficient of thermal expansion (CTE). To eliminate failures caused by the CTE mismatch (³300%) between metal and substrate material interface, we report for the first time Cu/GrCu composite which exhibits similar thermal conductivity to pure copper (390 W/(m•K)), much higher than the range of metal injection molded copper heat sink (320 340 W/(m•K)), while featuring low silicon-like CTE (³5 ppm/K). This is realized by injection parameter manipulation to not only reduce voids (vacancies) but increase the interface bonding through the use of electrodeposited copper on graphene (i.e., GrCu). Such excellent property locates the Cu/GrCu in the top of the Ashby map and shows excellent temperature stability with lower thermal distortion parameter (TDP). Thus, this excellent composite material is the only material simultaneously with high thermal conductivity and low CTE, making it uniquely suited for high power module applications, especially for hybrid and electric vehicles.

show abstract

Injection moulding of oxide reduced copper powders

Cited by 12 publications

References 8 publications

Characterization of the Metal Fused Filament Fabrication Process for Manufacturing of Pure Copper Inductors

Characterization of the Metal Fused Filament Fabrication Process for Manufacturing of Pure Copper Inductors

Metal Injected Copper Carbon Nanotube Composite Material with High Thermal Conductivity and Low CTE for IGBT Power Modules

Copper Like Thermal Conductivity and Silicon Like Coefficient of Thermal Expansion Copper Graphene for High Power IGBT by Metal Injection Molding

Contact Info

Product

Resources

About