Ink‐Jet Printing, Self‐Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature

Cheng, Kevin; Mo-hua, Yang; Chiu, Wanda W. W.; Huang, Chieh-Yi; Chang, J.H.; Ying, Tai-Fa; Yang, Yang

doi:10.1002/marc.200400462

Cited by 173 publications

(104 citation statements)

References 69 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…A typical resistivity value is 3.0 × 10 -7 Ω m, which is approximately 20× the bulk silver value. With thermal sintering in an oven (220 °C, 60 minutes) similar values are obtained, which is in agreement to what is reported by other authors (Cheng et al, 2005). It was recently discovered that conductive antenna structures are more susceptible for absorption of microwaves than the printed feature by itself (Perelaer et al, 2009b).…”

Section: Selective Sintering Of Silver Nanoparticle By Using Microwavsupporting

confidence: 91%

Inkjet Printing and Alternative Sintering of Narrow Conductive Tracks on Flexible Substrates for Plastic Electronic Applications

Perelaer¹,

Schubert²,

Jena³

2010

Radio Frequency Identification Fundamentals and Applications Design Methods and Solutions

View full text Add to dashboard Cite

Section: Selective Sintering Of Silver Nanoparticle By Using Microwavsupporting

confidence: 91%

Inkjet Printing and Alternative Sintering of Narrow Conductive Tracks on Flexible Substrates for Plastic Electronic Applications

Perelaer¹,

Schubert²,

Jena³

2010

Radio Frequency Identification Fundamentals and Applications Design Methods and Solutions

View full text Add to dashboard Cite

“…11 While many of these methods can produce impressive flexible features, the conductivity of non-metallic structures is generally poorer than deposited pure metals. Therefore, the metallization of polymers is commonly used due to high electrical performance and relatively low cost.…”

mentioning

confidence: 99%

Characterization of Stretchable Interconnects Fabricated Using a Low Cost Metallization Transfer Process onto PDMS

Hilbich

Gray

et al. 2015

ECS J. Solid State Sci. Technol.

View full text Add to dashboard Cite

The growing number of applications requiring conformal electronic devices incorporated into unconventional and dynamic surfaces has led to an increase in the development of stretchable electronics. Together with novel materials and fabrication processes, innovative conductive patterns are being developed in order to meet the needs of modern applications. Here, we present the design, fabrication, and characterization of first-order curved Peano structures fabricated using a newly developed thick film copper metallization transfer process onto PDMS. In order to maximize the stretchability of these structures, we present a characterization and analysis of the relationship between relative resistance and tensile strain in fabricated devices while systematically varying the geometric parameters of various curve designs. The response of the structures to cyclic failure and recovery is also characterized. These results demonstrate that the newly developed transfer process can be used to fabricate stretchable Peano curves and provide insight into the geometric optimization of these curves in stretchable electronics applications. Stretchable electronics is an emerging technology enabling new devices that cannot be fabricated using traditionally rigid substrates. The particular advantages of stretchable devices over their rigid counterparts are the ability to conform to a curved surface (for example, the human body), the ability to be folded within a constrained volume, and the ability to otherwise be physically flexed or stretched without failing. Example applications are particularly prevalent in biomedicine and include wearable monitoring devices, 1,2 implantable neural or muscular stimulators, 3 implantable drug delivery systems, 4 fluid control systems, 4 flexible sensors and actuators, 5-7 and flexible integrated circuit technology. 8 In an effort to further the development of these devices, there are two primary areas of improvement; the first area is in fabrication process technologies, and the second is in investigating new geometries that enable more effective stretchable structures.With respect to fabrication technologies, there are several existing processes suitable for the development of stretchable electronics, including the direct metallization of polymers, nanocomposite polymer (NCP) fabrication, 9 fabrication using conductive polymers, 10 and inkjet printing of conductive inks.11 While many of these methods can produce impressive flexible features, the conductivity of non-metallic structures is generally poorer than deposited pure metals. Therefore, the metallization of polymers is commonly used due to high electrical performance and relatively low cost. In previous work, 12 we have shown a new process for low-cost, large-scale, thick-film metallization of PDMS; in this work, we demonstrate the application of this process to stretchable electronics.Using a given process, stretchable metal patterns on polymers can generally be achieved with pre-stressed, thin-film, metal conductors that form stretchable m...

show abstract

“…Thin-film organic photovoltaic cells (OPVs) have attracted tremendous attention for their promise to provide low cost and light weight devices that can absorb a large proportion of the solar spectrum [1][2][3][4][5][6][7]. OPVs commonly use either a planar heterojunction (PHJ) structure [8,9], which consists of donor-acceptor bilayer deposition, or a bulk heterojunction (BHJ) structure, which consists of a donor-acceptor mixture as shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

Interpenetrating heterojunction photovoltaic cells based on C60 nano-crystallized thin films

Kohei

Shahiduzzaman

Yamamoto

et al. 2016

Organic Electronics

View full text Add to dashboard Cite

An interpenetrating heterojunction (IHJ) structure facilitates efficient charge separation and transport in the active layer of organic photovoltaic cells (OPVs). Additionally, the recombination of generated carriers in IHJs is reduced as these networks exhibit high carrier transport with minimal recombination sites. We have developed a simple method to fabricate nanocrystallized fullerene (C 60 ) films, which are produced by subjecting evaporated C 60 films to either solvent spin-coating or solvent vapor annealing (SVA). The size of the rod-shaped nanocrystals in the films were controlled by changing the solvent and annealing time.An 80-nm-diameter size nanocrystallized C 60 film that was fabricated using SVA with ethanol was incorporated as an acceptor material in an inverted IHJ OPV cell.Tetraphenyldibenzoperiflanthene (DBP) was evaporated onto the nanocrystallized C 60 film as the donor material. The power conversion efficiency of an IHJ OPV cell (ITO/TiOx/nanocrystallized C 60 film/DBP/MoO 3 /Au) increased from 1.79% to 2.12%, when compared with the conventional PHJ OPV cell.

show abstract

Ink‐Jet Printing, Self‐Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature

Cited by 173 publications

References 69 publications

Inkjet Printing and Alternative Sintering of Narrow Conductive Tracks on Flexible Substrates for Plastic Electronic Applications

Inkjet Printing and Alternative Sintering of Narrow Conductive Tracks on Flexible Substrates for Plastic Electronic Applications

Characterization of Stretchable Interconnects Fabricated Using a Low Cost Metallization Transfer Process onto PDMS

Interpenetrating heterojunction photovoltaic cells based on C60 nano-crystallized thin films

Contact Info

Product

Resources

About