Inkjet printed single layer high-density circuitry for a MEMS device

Laurila, Mika-Matti; Soltani, Ayat; Mäntysalo, Matti

doi:10.1109/ectc.2015.7159712

Cited by 8 publications

(7 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Because the layer thickness scales with layer width, multilayer printing is necessary to achieve electrically functional features (e.g. conductors, pin-hole free dielectrics) [78,79] (see figures 5(A) and (B)). A further complication is the small print height (tens to a few hundred microns), which is necessary to achieve a highenough electric field for droplet ejection.…”

Section: Electrohydrodynamic Inkjet Printingmentioning

confidence: 99%

Additively fabricated on-skin sensors for mechanical and thermal biosignal monitoring

Laurila

2023

Flex. Print. Electron.

Self Cite

View full text Add to dashboard Cite

Continuous bio-signal monitoring with on-skin worn sensor devices enables out-of-hospital patient monitoring (i.e. ubiqutuous health-care) which has high potential to reduce various disease related societal costs through large-scale screening of the disease risk groups. However, novel fabrication methods need to be adopted to enable the required large-scale deployment of such devices. Additive fabrication technologies have emerged as potential candidate to meet this challenge due to their low material consumption, scalability and compatibility with skin-conformable low Tg polymeric substrates. This review article discusses recent advances in additively fabricated on-skin bio-signal sensors and focuses on the following topics: 1) available additive fabrication technologies, 2) on-skin measurable mechanical and thermal bio-signals and related additively fabricated bio-signal sensors and 3) the emerging field of printed electronic tattoo (e-tattoo) type mechanical and thermal bio-signal sensors are discussed.

show abstract

Section: Electrohydrodynamic Inkjet Printingmentioning

confidence: 99%

Additively fabricated on-skin sensors for mechanical and thermal biosignal monitoring

Laurila

2023

Flex. Print. Electron.

Self Cite

View full text Add to dashboard Cite

show abstract

“…If the viscosity of the ink is too high, the ink cannot be loaded to the tip of the nozzle. The metal nanoparticle conductive inks have been intensively printed high-density circuitry for a MEMS Device 80 , source/drain electrodes in OFETs 79 and other electronics applications, such as resistive fuse-type write-once-readmany (WORM) memory 78 , metallization of the through silicon vias 84 and mm-wave bandpass filter 82 . The low viscosity of the ink mentioned above was typically in the range of 5 20 mPa•s, and the resolution reached 2 μm.…”

Section: ∼ ∼mentioning

confidence: 99%

An overview on the principle of inkjet printing technique and its application in micro-display for augmented/virtual realities

Yang¹,

Lin²,

Wu³

et al. 2022

OEA

View full text Add to dashboard Cite

Augmented reality (AR) and virtual reality (VR) are two novel display technologies that are under updates. The essential feature of AR/VR is the full-color display that requires high pixel densities. To generate three-color pixels, the fluorescent color conversion layer inevitably includes green and red pixels. To fabricate such sort of display kits, inkjet printing is a promising way to position the color conversion layers. In this review article, the progress of AR/VR technologies is first reviewed, and in succession, the state of the art of inkjet printing, as well as two key issues -the optimization of ink and the reduction of coffee-ring effects, are introduced. Finally, some potential problems associated with the color converting layer are highlighted.

show abstract

“…Additionally, a second test vehicle called 'via chain' has been designed in order to check the repeatability of the connection banks. In this test vehicle, the width and space of the connection banks are kept constant (W = 70 µm, S = 50 µm), and a variable number of via banks (2,4,8,16,32) have been placed between two pads. The aim is to check the resistance between two pads after wiring the banks by filling the vias, in order to calculate the resistance per via accurately in this structure with the variability given by the DoD printing process.…”

Section: Connection Structurementioning

confidence: 99%

“…The equipment draws its heritage from electrospraying technology used for the atomization of liquid; it is a type of electrohydrodynamic (EHD) printing process, which utilizes the oscillating electric field to generate the necessary pressure for droplet ejection. This enables the generation of sub-femtoliter droplets and micron-scale resolution when the substrate wetting conditions are suitable [30][31][32]. The large surface area-to-volume ratio of the in-flight droplets and the resultant fast evaporation rate of solvent can be also utilized in fast printing of 3D structures such as pillars and bumps [33].…”

Section: Superfine Inkjet Printingmentioning

confidence: 99%

Chip-by-chip configurable interconnection using digital printing techniques

Mashayekhi

Winchester

Laurila

et al. 2017

J. Micromech. Microeng.

View full text Add to dashboard Cite

Printed electronics technologies add new fabrication concepts to the classical set of microelectronic processes. Among these, the use of digital printing techniques such as inkjet permits the deposition of materials on top of preexisting substrates without any mask. This allows individual personalization of electronic circuits. Different proposals have been made to make use of such a property: (1) wiring new metallic layers on top of circuits to build programmable logic array-like circuits, (2) programming OTP ROM like memories, and (3) building inkjet-configurable gate arrays. The capability of building an individual circuit with technological steps simpler than photolithographic ones opens a concept similar to the successful field programmable gate array. Although nowadays the process resolution is still low, it can quickly evolve to higher wiring densities and therefore permit a greater level of transistor integration. In this paper, we propose a new structure to realize the connections only by deposition of conductive dots oriented to optimize the area needed to implement the drop-on-demand (DoD) wiring at circuit level. One important feature of this structure is that it minimizes the amount of printed material required for the connection thereby reducing failures often seen with DoD printing techniques for conductive lines. These structures have been validated by two different DoD technologies: inkjet and superfine jet, and have been compared to mask-based photolithography technology with promising results.

show abstract

Inkjet printed single layer high-density circuitry for a MEMS device

Cited by 8 publications

References 16 publications

Additively fabricated on-skin sensors for mechanical and thermal biosignal monitoring

Additively fabricated on-skin sensors for mechanical and thermal biosignal monitoring

An overview on the principle of inkjet printing technique and its application in micro-display for augmented/virtual realities

Chip-by-chip configurable interconnection using digital printing techniques

Contact Info

Product

Resources

About