Inkjet-printed, vertically-integrated, high-performance inductors and transformers on flexible LCP substrate

Cook, Benjamin S.; Mariotti, C.; Cooper, James R.; Revier, Daniel; Tehrani, Bijan; Aluigi, Luca; Roselli, L.; Tentzeris, Manos M.

doi:10.1109/mwsym.2014.6848575

Cited by 49 publications

(29 citation statements)

References 8 publications

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“…For these reasons, particular attention has to be given by the scientific community to the demonstration of substrate independent processes which make possible the application of the devices on many materials, especially those not normally used in electronics [85]. Common substrate independent processes which fit these requirements are: inkjet printing [7], 3D printing, gravure printing, screen printing and metal adhesive laminate [86,87].…”

Section: A Wpt Integration In Buildingsmentioning

confidence: 99%

Europe and the Future for WPT : European Contributions to Wireless Power Transfer Technology

Team¹

2017

IEEE Microwave

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Section: A Wpt Integration In Buildingsmentioning

confidence: 99%

Europe and the Future for WPT : European Contributions to Wireless Power Transfer Technology

Team¹

2017

IEEE Microwave

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“…36,37 A 25 nH inductor with a Q approaching nine was also shown in 2014. 38 All of these printed inductors utilize nanoparticle ink as well as a sintering temperature greater than 150 0 C. In order to make repeatable, quality RF components by inkjet, a robust metal ink with high conductivity is required. The SOC ink developed here presents improved performance over nanoparticle ink and provides high value inductors with quality factors approaching 15.…”

Section: Inkjet-printed Rf Inductorsmentioning

confidence: 99%

Robust Design of a Particle-Free Silver-Organo-Complex Ink with High Conductivity and Inkjet Stability for Flexible Electronics

Vaseem

McKerricher

Shamim

2015

ACS Appl. Mater. Interfaces

103

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Currently, silver nanoparticle based inkjet ink is commercially available. This type of ink has several serious problems such as a complex synthesis protocol, high cost, high sintering temperatures (~200 0 C), particle aggregation, nozzle clogging, poor shelf life, and jetting instability. For the emerging field of printed electronics, these short comings in conductive inks are barriers for their wide spread use in practical applications. Formulating particle free silver inks has potential to solve these issues, and requires careful design of the silver complexation.The ink complex must meet various requirements, such as in-situ reduction, optimum viscosity, 2 storage and jetting stability, smooth uniform sintered films, excellent adhesion, and high conductivity. This study presents a robust formulation of silver-organo-complex (SOC) ink, where complexing molecules act as reducing agents. The 17 weight percent silver loaded ink was printed and sintered on a wide range of substrates with uniform surface morphology and excellent adhesion. The jetting stability was monitored for 5 months to confirm that the ink was robust and highly stable with consistent jetting performance. Radio frequency inductors which are highly sensitive to metal quality were demonstrated as a proof of concept on flexible PEN substrate. This is a major step towards producing high quality electronic components with a robust inkjet printing process.

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“…Since then, there have been material and printing advancements enabling 2D printed inductors and capacitors with high-frequency Q's below 10 (Refs. [8][9][10]. To the authors best knowledge, the combination of these fully printed components to design a GHz lumped element filter has never been demonstrated.…”

Section: Introductionmentioning

confidence: 99%

Fully inkjet-printed microwave passive electronics

2017

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Fully inkjet-printed three-dimensional (3D) objects with integrated metal provide exciting possibilities for on-demand fabrication of radio frequency electronics such as inductors, capacitors, and filters. To date, there have been several reports of printed radio frequency components metallized via the use of plating solutions, sputtering, and low-conductivity pastes. These metallization techniques require rather complex fabrication, and do not provide an easily integrated or versatile process. This work utilizes a novel silver ink cured with a low-cost infrared lamp at only 80°C, and achieves a high conductivity of 1 × 10 7 S m −1. By inkjet printing the infrared-cured silver together with a commercial 3D inkjet ultraviolet-cured acrylic dielectric, a multilayer process is demonstrated. By using a smoothing technique, both the conductive ink and dielectric provide surface roughness values of o500 nm. A radio frequency inductor and capacitor exhibit state-of-the-art quality factors of 8 and 20, respectively, and match well with electromagnetic simulations. These components are implemented in a lumped element radio frequency filter with an impressive insertion loss of 0.8 dB at 1 GHz, proving the utility of the process for sensitive radio frequency applications.

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Inkjet-printed, vertically-integrated, high-performance inductors and transformers on flexible LCP substrate

Cited by 49 publications

References 8 publications

Europe and the Future for WPT : European Contributions to Wireless Power Transfer Technology

Europe and the Future for WPT : European Contributions to Wireless Power Transfer Technology

Robust Design of a Particle-Free Silver-Organo-Complex Ink with High Conductivity and Inkjet Stability for Flexible Electronics

Fully inkjet-printed microwave passive electronics

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