2006
DOI: 10.1002/pssc.200565104
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InN: Fermi level stabilization by low‐energy ion bombardment

Abstract: The near-surface electronic properties of InN have been investigated with high-resolution electron-energyloss spectroscopy. Low-energy (∼ 400 eV) nitrogen ion bombardment followed by low temperature annealing (< 300• C) was found to dramatically increase the n-type conductivity of InN, close to the surface. This is explained in terms of the formation of amphoteric defects from the ion bombardment and annealing combined with the band structure of InN. Low-energy ion bombardment and annealing is shown to result … Show more

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Cited by 4 publications
(3 citation statements)
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“…This type of uncompensated n -type defect chemistry behavior is also seen for other materials (e.g., InN and InAs ) where very large carrier concentrations are sustainable. For In 2 O 3 , the E g FS has been reported to be in the range 0.30–0.65 eV above the CBM. , If you take into account that the effective mass for CdO is reported to be less than or comparable to that of In 2 O 3 , and use eq , then it is clear that CdO can sustain a much higher carrier concentration than In 2 O 3 .…”
Section: Discussionsupporting
confidence: 55%
“…This type of uncompensated n -type defect chemistry behavior is also seen for other materials (e.g., InN and InAs ) where very large carrier concentrations are sustainable. For In 2 O 3 , the E g FS has been reported to be in the range 0.30–0.65 eV above the CBM. , If you take into account that the effective mass for CdO is reported to be less than or comparable to that of In 2 O 3 , and use eq , then it is clear that CdO can sustain a much higher carrier concentration than In 2 O 3 .…”
Section: Discussionsupporting
confidence: 55%
“…Eisenhardt et al measured a decrease of downward surface band bending by 0.2 eV during K adsorption due to disappearance of In-adlayer induced surface states above conduction band [17]. The extreme band bending at the sputtered and annealed InN surface is instead explained by the formation of donor-like defects during the sputtering (despite the low energies employed) most likely nitrogen vacancies localized within the near-surface region, consistent with earlier electron energy loss spectroscopy measurements [35]. During the preparation of clean InN surface by N 2 + ion sputtering and low temperature annealing, reformation of In and N atoms at the surface of InN occurs.…”
Section: Resultssupporting
confidence: 66%
“…Oxidized samples were studied because the conventional cleaning method, ion bombardment and annealing, produces donorlike defects near the surface of InN and In-rich InGaN alloys, resulting in an increased near-surface electron concentration. [17][18][19][20] Unconventional methods have been successful in cleaning both InN ͑Ref. 19͒ and GaN; 21 however, cleaning InGaN alloys would require such methods to be optimized for each composition and hence cleaning is not a practical process to employ.…”
Section: Samples Of 200 Nm Thick Inmentioning
confidence: 99%