Innovations in LCD technology

Tombling, C.; Tillin, Martin

doi:10.1016/s0379-6779(00)01339-4

Cited by 5 publications

(2 citation statements)

References 12 publications

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“…Table 1 shows seven affective components that were screened by expert panel. We also investigated various design variables affecting LCD image quality such as DPI, brightness, contrast, color, angle of vision, and a delay of response from related works [10,11]. We analyzed hierarchical structure of extracted components utilizing AHP again.…”

Section: Experiments 1: Evaluation Of User Satisfactionmentioning

confidence: 99%

Incorporating JND into the Design of Mobile Device Display

Lee

Suh

Lee

et al. 2007

Usability and Internationalization. HCI and Culture

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The main purpose of this article is to incorporate the JND (Just Noticeable Difference) into the design of mobile device display, especially LCD display of mobile phone. JND is the difference threshold between stimuli that can be detectable by human sense. Thirty participants were employed for two experimentations in order to find out JND value of sensation for LCD. The critical design variables of LCD and the affective component of user satisfaction were investigated using AHP and regression analysis. Finally, the JND of design variables of LCD and its characteristics were investigated.

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Section: Experiments 1: Evaluation Of User Satisfactionmentioning

confidence: 99%

Incorporating JND into the Design of Mobile Device Display

Lee

Suh

Lee

et al. 2007

Usability and Internationalization. HCI and Culture

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“…[1][2][3][4] Chipon-glass (COG) technologies using an anisotropic conductive film (ACF) or solder bumps have been investigated to attach an IC chip directly on a glass substrate of a LCD panel. [5][6][7][8][9][10][11][12][13][14] COG technologies can accommodate high density and fine pitch interconnection between the LCD panel and the driver IC, reduce an interconnect distance, and make the LCD devices thinner and smaller.…”

Section: Introductionmentioning

confidence: 99%

Contact Resistance of the Chip-on-Glass Bonded 48Sn–52In Solder Joint

et al. 2005

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An average contact resistance of a COG joint bonded with 48Sn-52In solder was characterized using daisy chain structure. The average contact resistances of the 48Sn-52In solder joint of 29 mm diameter and 14 mm height were 132 m/bump, 28.5 m/bump, and 8.6 m/bump on Ti(0.1 mm)/Cu(1.5 mm), Ti(0.1 mm)/Cu(1.5 mm)/Au(0.1 mm), and Ti(0.1 mm)/Cu(3 mm)/Au(0.1 mm) UBMs, respectively. Such difference in the average contact resistance of the 48Sn-52In solder joint on each UBM could be attributed to partial oxidation of the Cu UBM layer during solder evaporation and a difference of the thickness of the Cu UBM layer remaining underneath the intermetallic compounds after soldering.

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