2007
DOI: 10.1002/adem.200700013
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Innovative Approach to Metal Matrix Composites Film by Tape Casting Process

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Cited by 17 publications
(10 citation statements)
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“…The weight loss at higher temperatures may be attributed to the binder burnout. [30][31][32] In order to get good microwave dielectric properties after sintering the tape, the organic additives have to be removed prior to densification. 33 If a fast heating rate is employed, chances are there for the formation of cracks or bubbles and the delamination of stacked layers of the tape.…”
Section: Resultsmentioning
confidence: 99%
“…The weight loss at higher temperatures may be attributed to the binder burnout. [30][31][32] In order to get good microwave dielectric properties after sintering the tape, the organic additives have to be removed prior to densification. 33 If a fast heating rate is employed, chances are there for the formation of cracks or bubbles and the delamination of stacked layers of the tape.…”
Section: Resultsmentioning
confidence: 99%
“…High thermal conductivity combined with low coefficient of thermal expansion (CTE) heat-sinks has played an important role in achieving high-performance and high reliability for electronic devices and modules [1][2][3][4][5][6]. Next generation heat sink materials, which are different kinds of thermally adapted materials, have already been suggested and some have been tested on C/C, Cu/diamond, and Cu/ CNF.…”
Section: Introductionmentioning
confidence: 99%
“…Nanostructured refractory metals, such as nanostructured tungsten (W), offer a great potential for applications in critical conditions such as aerospace, electronics, lighting and medicine [1][2][3][4] due to their high melting point, good mechanical and physical properties [5][6][7]. Ion beam sputtering techniques employing a multilayer elaboration process is used in this work to fabricate nanostructured W thin films.…”
Section: Introductionmentioning
confidence: 99%
“…The method consists in sputtering tungsten and copper (two immiscible metals) alternatively on polyimide substrates with the control of the thickness of each sub-layer in the nanometre range [8]. The obtained composites present interesting properties including good conductivity (thermal and electrical), enhanced mechanical properties (high strength of W combined with improved ductility of Cu) [1,[9][10] and a flexible polymer substrate for use in technological applications such as sensors and stretchable microelectronics components [11][12][13]. Given the complex microstructure of the nanostructured materials due to the small grain size, strong crystallographic texture, high density of defects and significant grain boundary areas [14][15][16][17], their mechanical behaviour is particularly affected and not well understood yet.…”
Section: Introductionmentioning
confidence: 99%