Innovative UV nanoimprint lithography using a condensable alternative chlorofluorocarbon atmosphere

Matsui, Shinji; Hiroshima, Hiroshi; Hirai, Yoshihiko; Nakagawa, Masaru

doi:10.1016/j.mee.2014.10.016

Cited by 48 publications

(42 citation statements)

References 114 publications

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“…2(a) and 2(b), the pattern fabricated in PFP shows a more granular surface compared with that in air. PFP has a known characteristic that it is absorbed into the acrylate-based PAK-01 resin [30][31], which can result in degradation of the pattern quality with regards to line edge roughness and surface roughness, compared with that in air. As can be seen from DFM images in Figs.…”

Section: Surface Roughnessmentioning

confidence: 99%

Ultraviolet Nanoimprint Lithography in the Mixture of Condensable Gases with Different Vapor Pressures

Suzuki

Youn

Hiroshima

2016

J. Photopol. Sci. Technol.

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UV nanoimprint lithography (UV-NIL) in condensable gases such as pentafluoropropane (PFP) has been recognized as one of the most promising methods to realize bubble-defect-free UV-NIL with low demolding forces when compared with that in ambient air and He. We have recently studied two condensable gases [trans-1-chloro-3,3,3-trifluoropropene (CTFP) and trans-1,3,3,3-tetrafluoropropene (TFP)] with different vapor pressures and low global warming potentials (GWP) of <6. However, the resulting lithographic pattern quality in UV-NIL remains unclear using CTFP and TFP. In this work, the surface roughness of patterns fabricated using UV-NIL in the CTFP and TFP gases was investigated. In UV-NIL in a CTFP/TFP atmosphere, with an increase in the TFP fraction, the surface roughness decreased. It was also found that the linewidth of tens of nanometer size patterns can be linearly controlled by adjusting the CTFP/TFP fraction; for 70-nm-wide line patterns, the linewidth adjusting ratio was approximately 14%.

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Section: Surface Roughnessmentioning

confidence: 99%

Ultraviolet Nanoimprint Lithography in the Mixture of Condensable Gases with Different Vapor Pressures

Suzuki

Youn

Hiroshima

2016

J. Photopol. Sci. Technol.

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“…However, neither method can be applied without increasing the manufacturing complexity and costs. Moreover, a helium atmosphere increases the demolding force compared to that of air ( Figure 2 ) [ 34 ]. In addition to performing imprinting in a helium environment, the application of a condensable gas (e.g., pentafluoropropane, CHF 2 CH 2 CF 3 ; PFP) for bubble elimination was also proposed [ 34 , 35 ].…”

Section: Characteristics and Issues In Thermal And Uv Nanoimprint Lithographymentioning

confidence: 99%

Interfacial Interactions during Demolding in Nanoimprint Lithography

Chen

Luo

et al. 2021

Micromachines

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Nanoimprint lithography (NIL) is a useful technique for the fabrication of nano/micro-structured materials. This article reviews NIL in the field of demolding processes and is divided into four parts. The first part introduces the NIL technologies for pattern replication with polymer resists (e.g., thermal and UV-NIL). The second part reviews the process simulation during resist filling and demolding. The third and fourth parts discuss in detail the difficulties in demolding, particularly interfacial forces between mold (template) and resist, during NIL which limit its capability for practical commercial applications. The origins of large demolding forces (adhesion and friction forces), such as differences in the thermal expansion coefficients (CTEs) between the template and the imprinted resist, or volumetric shrinkage of the UV-curable polymer during curing, are also illustrated accordingly. The plausible solutions for easing interfacial interactions and optimizing demolding procedures, including exploring new resist materials, employing imprint mold surface modifications (e.g., ALD-assisted conformal layer covering imprint mold), and finetuning NIL process conditions, are presented. These approaches effectively reduce the interfacial demolding forces and thus lead to a lower defect rate of pattern transfer. The objective of this review is to provide insights to alleviate difficulties in demolding and to meet the stringent requirements regarding defect control for industrial manufacturing while at the same time maximizing the throughput of the nanoimprint technique.

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“…The stress mechanism of the resist and template and the reasons for defects were analyzed [2][3][4]. To suppress the release load and eliminate defects, using novel mold with low surface energy materials [5], increased performance of the resist [6], structure modification or novel template release methods have been proposed [7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Analysis of Debonding Problem during Demolding Process of Nanoimprinting

Wang

Zhang

et al. 2017

J. Photopol. Sci. Technol.

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Template release process during nanoimprint lithography was investigated, and the detailed steps of this process were described in order to reduce defects caused by demolding process. The debonding problem was discussed by using optimization of model, numerical simulation and theoretical analysis. The rules and mechanism of debonding were obtained by analyzing the relations between the bonding strength and the vertical stresses of the cementing surface linking the residual layer and the substrate in terms of stress balance theory in fracture mechanics. The location and demolding process which is prone to debond were analyzed. It is concluded that the debonding phenomenon took place at the intermediate position during the second demolding stage, when the adhesion force between the resist and the mold was 0.8 times of other interfaces between the mold and the resist. The debonding phenomenon took place at the angular position during the fourth demolding stage, when the adhesion force between the resist and the mold was 1.2 times bigger than the other interfaces between the mold and the resist.

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Innovative UV nanoimprint lithography using a condensable alternative chlorofluorocarbon atmosphere

Cited by 48 publications

References 114 publications

Ultraviolet Nanoimprint Lithography in the Mixture of Condensable Gases with Different Vapor Pressures

Ultraviolet Nanoimprint Lithography in the Mixture of Condensable Gases with Different Vapor Pressures

Interfacial Interactions during Demolding in Nanoimprint Lithography

Analysis of Debonding Problem during Demolding Process of Nanoimprinting

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