“…The integration of compound semiconductor devices on silicon substrates has been examined for many years. − Successful integration of III−V devices onto silicon-integrated circuits would allow for new architectures with much greater functionality. − Of particular interest to us is the integration of indium phosphide on silicon, since indium phosphide is a technologically important material and widely used in high-speed electronics. − In addition, indium phosphide is an interesting photoelectrode material because of the high reported photovoltage of liquid junction cells fabricated with p-type InP. , However, the principal difficulties with the integration of InP on Si are the presence of a polar/nonpolar interface and the large lattice mismatch between the two semiconductors. These properties result in high defect densities in the III−V materials that degrade device performance. ,, One way to tackle this problem is to fabricate InP devices out of one-dimensional, free-standing nanowires, which are very good at accommodating lattice strain and thermal mismatch. , …”