1985
DOI: 10.1117/12.948244
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InP Gunn Diode Sources

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Cited by 12 publications
(2 citation statements)
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“…The accumulation layers formed a little closer to the anode than cathode (about mid way) and grew in size as they transferred from the cathode to anode at the saturation velocity. The resulting frequency was well approximated by f = 2.25×10 5 /Lac Hz (a little over twice the saturation drift velocity of about 0.9×10 5 ms -1 in GaAs and 1.1×10 5 ms -1 at 1x10 6 Vm -1 in InGaAs [31]) over the distance between anode and cathode Lac) [8,17]. Higher biases were needed in the simulation to maintain accumulation layer oscillations as Lac was decreased.…”
Section: Monte Carlo Modelingmentioning
confidence: 99%
“…The accumulation layers formed a little closer to the anode than cathode (about mid way) and grew in size as they transferred from the cathode to anode at the saturation velocity. The resulting frequency was well approximated by f = 2.25×10 5 /Lac Hz (a little over twice the saturation drift velocity of about 0.9×10 5 ms -1 in GaAs and 1.1×10 5 ms -1 at 1x10 6 Vm -1 in InGaAs [31]) over the distance between anode and cathode Lac) [8,17]. Higher biases were needed in the simulation to maintain accumulation layer oscillations as Lac was decreased.…”
Section: Monte Carlo Modelingmentioning
confidence: 99%
“…10). The typical temperature increase DT op remains below 100 K at maximum RF output power (25,38), and low operating active-layer temperatures ensure reliability and excellent temperature stability over wide temperature ranges of À30 C to þ70 C for devices at 56 GHz (38) and 94 GHz (38,39) as well as of 0 C to 50 C for devices at 140 GHz (25). The temperaturedependent performance of a D-band InP Gunn device in Fig.…”
Section: Current-limiting Cathode Contactmentioning
confidence: 99%