Negative capacitance field effect transistors made of
Hf0.5Zr0.5O2 (HZO) are one of the
most promising
candidates for low-power-density devices because of the extremely
steep subthreshold swing and high open-state currents resulting from
the addition of ferroelectric materials in the gate dielectric layer.
In this paper, HZO thin films were prepared by magnetron sputtering
combined with rapid thermal annealing. Their ferroelectric properties
were adjusted by changing the annealing temperature and the thickness
of HZO. Two-dimensional MoS2 back-gate negative capacitance
field-effect transistors (NCFETs) based on HZO were prepared as well.
Different annealing temperatures, thicknesses of HZO thin films, and
Al2O3 thicknesses were studied to achieve optimal
capacitance matching, aiming to reduce both the subthreshold swing
of the transistor and the hysteresis of the NCFET. The NCFET exhibits
a minimum subthreshold swing as low as 27.9 mV/decade, negligible
hysteresis (∼20 mV), and the I
ON/I
OFF of up to 1.58 × 107. Moreover, a negative drain-induced barrier lowering effect and
a negative differential resistance effect have been observed. This
steep-slope transistor is compatible with standard CMOS manufacturing
processes and attractive for 2D logic and sensor applications as well
as future energy-efficient nanoelectronic devices with scaled power
supplies.