Instrumented chip dedicated to semiconductor temperature measurements in power electronic converters

Ka, Ibrahima; Avenas, Yvan; Dupont, Laurent; Vafaei, Raha; Thollin, Benoit; Crébier, Jean-Christophe; Petit, Mickaël

doi:10.1109/ecce.2016.7855208

Cited by 6 publications

(2 citation statements)

References 16 publications

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“…TTCs can be suitable for on-line temperature measurements. Various types of TTCs have been realized, such as integrated diodes and resistance temperature detectors (RTDs) [67][68][69][70][71][72][73][74][75]. As the forward voltage of the diodes strongly depends on the temperature variation, the measure of the voltage drop can be used for temperature estimation.…”

Section: Thermal Test Chipsmentioning

confidence: 99%

“…A string of diodes on the top of the chip has been fabricated and the measurement of the JT has been performed by measuring the forward voltage drop. Instead, in [69] a thin-film RTD placed on the top of the IGBT chip has been realized to measure the average temperature of the die. A similar solution where an NTC thermistor has been embedded in the IGBT power module has been also investigated [70].…”

Section: Thermal Test Chipsmentioning

confidence: 99%

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Two Decades of Condition Monitoring Methods for Power Devices

2021

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Condition monitoring (CM) of power semiconductor devices enhances converter reliability and customer service. Many studies have investigated the semiconductor devices failure modes, the sensor technologies, and the signal processing techniques to optimize the CM. Furthermore, the improvement of power devices’ CM thanks to the use of the Internet of Things and artificial intelligence technologies is rising in smart grids, transportation electrification, and so on. These technologies will be widespread in the future, where more and more smart techniques and smart sensors will enable a better estimation of the state of the health (SOH) of the devices. Considering the increasing use of power converters, CM is essential as the analysis of the data obtained from multiple sensors enables the prediction of the SOH, which, in turn, enables to properly schedule the maintenance, i.e., accounting for the trade-off between the maintenance cost and the cost and issues due to the device failure. From this perspective, this review paper summarizes past developments and recent advances of the various methods with the aim of describing the current state-of-the-art in CM research.

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