150-250 words)In laser micromachining, the ablation threshold (minimum fluence required to cause ablation) is a key performance parameter and overall indicator of the efficiency of material removal. For pulsed-laser micromachining, this important observable depends upon material properties, pulse properties and the number of pulses applied in a complex manner that is not yet well understood. The incubation effect is one example. It manifests as a change in the ablation threshold as a function of number of laser pulses applied, and is driven by photoinduced defect accumulation in the material. Here we study femtosecond (800 nm, 110 fs, 0.1 to 1 mJ/pulse) micromachining of a material with well-defined initial defect concentrations: doped Si across a range of dopant types and concentrations. The single pulse ablation threshold (Fth,1) was observed to decrease with increasing dopant concentration, from a maximum of 0.70 J/cm 2 (± 0.02) for undoped Si, to 0.51 J/cm 2 (± 0.01) for highly N-type doped Si.The effect was greater for N-type doped Si than for P-type, consistent with the higher carrier mobility of electrons compared to holes. In contrast, the infinite pulse ablation threshold (Fth,∞) was the same for all doping levels and types. We attribute this asymptotic behaviour to a maximum defect concentration that is independent of the initial defect concentration and type. These results lend insight into the mechanism of multi-pulse, femtosecond laser ablation. (225 words)