Integrated 122-GHz Antenna on a Flexible Polyimide Substrate With Flip Chip Interconnect

Beer, Stefan; Gulan, Heiko; Rusch, Christian; Zwick, Thomas

doi:10.1109/tap.2012.2232260

Cited by 47 publications

(10 citation statements)

References 40 publications

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“…A reliable flexible substrate, Kapton is a low cost, has thermal endurance with mechanical robustness and a low loss factor over a wide range of frequencies [ 14 ]. Numerous compact Kapton-based flexible antennas are represented with different dimensions, conductive materials and range of frequencies [ 11 , 26 , 53 , 54 , 55 , 56 ] as presented in Table 3 . In general, Kapton shows good soldering tolerance for flexible antenna fabrication as it withstands high temperature, which is a good feature for the thermal annealing of inkjet antenna printing [ 142 ].…”

Section: Flexible Substrate Materials For Wearable Antennasmentioning

confidence: 99%

“…A lot of research has already explored numerous materials which exhibit suitable properties as a substrate for conductive materials for antennas are conductive polymers [ 28 , 29 , 30 , 31 , 32 , 33 , 34 ], conductive threads [ 35 , 36 , 37 ] and conductive textile [ 38 , 39 , 40 , 41 , 42 , 43 , 44 , 45 , 46 , 47 , 48 , 49 , 50 , 51 , 52 ]. For dielectric materials, Polyimide (PI) [ 7 , 11 , 26 , 29 , 53 , 54 , 55 , 56 , 57 , 58 , 59 ], Polyethylene Terephthalate (PET) [ 60 , 61 , 62 , 63 , 64 , 65 , 66 , 67 ], Polydimethylsiloxane (PDMS) [ 68 , 69 , 70 , 71 , 72 , 73 , 74 , 75 , 76 ], P...…”

Section: Introductionmentioning

confidence: 99%

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Bending Analysis of Polymer-Based Flexible Antennas for Wearable, General IoT Applications: A Review

et al. 2021

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Flexible substrates have become essential in order to provide increased flexibility in wearable sensors, including polymers, plastic, paper, textiles and fabrics. This study is to comprehensively summarize the bending capabilities of flexible polymer substrate for general Internet of Things (IoTs) applications. The basic premise is to investigate the flexibility and bending ability of polymer materials as well as their tendency to withstand deformation. We start by providing a chronological order of flexible materials which have been used during the last few decades. In the future, the IoT is expected to support a diverse set of technologies to enable new applications through wireless connectivity. For wearable IoTs, flexibility and bending capabilities of materials are required. This paper provides an overview of some abundantly used polymer substrates and compares their physical, electrical and mechanical properties. It also studies the bending effects on the radiation performance of antenna designs that use polymer substrates. Moreover, we explore a selection of flexible materials for flexible antennas in IoT applications, namely Polyimides (PI), Polyethylene Terephthalate (PET), Polydimethylsiloxane (PDMS), Polytetrafluoroethylene (PTFE), Rogers RT/Duroid and Liquid Crystal Polymer (LCP). The study includes a complete analysis of bending and folding effects on the radiation characteristics such as S-parameters, resonant frequency deviation and the impedance mismatch with feedline of the flexible polymer substrate microstrip antennas. These flexible polymer substrates are useful for future wearable devices and general IoT applications.

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Section: Flexible Substrate Materials For Wearable Antennasmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Bending Analysis of Polymer-Based Flexible Antennas for Wearable, General IoT Applications: A Review

et al. 2021

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“…Recently, a packaging solution based on flip-chip technology was presented, which also eliminates bond wire transitions by routing through the antenna substrate. The packaging solution uses flexible polyimide substrate and demonstrated an AiP with 10 dBi gain and 80% radiation efficiency [16]. The embedded wafer ball grid array (eWLB) on account of its small form factor, higher I/O density, integration flexibility and superior mm-wave electrical performance has certainly a distinct advantage over the traditional packages such as BGA or quad flat no leads package (QFN) [17].…”

Section: Sip Concept and Architecturementioning

confidence: 99%

A SiGe-based fully-integrated 122-GHz FMCW radar sensor in an eWLB package

Furqan

Ahmed

Feger

et al. 2017

Int. J. Microw. Wireless Technol.

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High-performance SiGe HBTs and advancements in packaging processes have enabled system-in-package (SiP) designs for millimeter-wave applications. This paper presents a 122-GHz bistatic frequency modulated continuous wave (FMCW) radar SiP. The intended applications for the SiP are short-range distance and angular position measurements as well as communication links between cooperative radar stations. The chip is realized in a 130-nm SiGe BiCMOS technology and is based on a fully differential frequency-multiplier chain with in phase quadrature phase receiver and a binary phase shift keying modulator in the transmit chain. On-wafer measurement results show a maximum transmit output power of 2.7 dBm and a receiver gain of 11 dB. The chip consumes a DC power of 570 mW at a supply voltage of 3.3 V. The fabricated chip is integrated in an embedded wafer level ball grid array (eWLB) package. Transmit/receive rhombic antenna arrays with eight elements are designed in two eWLB packages with and without backside metal, with a measured peak gain of 11 dBi. The transceiver chip size is 1.8 mm × 2 mm, while the package size is 12 mm × 6 mm, respectively. FMCW measurements have been conducted with a sweep bandwidth of up to 17 GHz and a measured range resolution of 1.5 cm has been demonstrated. 2D positions of multiple targets have been computed using two coherently linked radar stations.

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“…It has become an important material in the fields of electronics, military, aerospace and other high-tech industries (Beer et al, 2013;Cheng et al, 2009;Khaleel et al, 2012;Shin et al, 2007). It has become an important material in the fields of electronics, military, aerospace and other high-tech industries (Beer et al, 2013;Cheng et al, 2009;Khaleel et al, 2012;Shin et al, 2007).…”

Section: Introductionmentioning

confidence: 99%

The control system for precise five-axis laser/micro-milling machine tool

Zhang

Chen

Liu

et al. 2016

IJISE

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Due to the limitation that etching technique is difficult to machine the copper layer of copper-clad polyimide (CCPI) with three-dimensional structure precisely and integrally, an effective way combining laser and micro-milling is proposed to solve this problem. By detecting the control of these two processing methods, a precise five-axis laser/micro-milling machine tool has been developed. The machine tool is based on SIEMENS 840D sl CNC system. The high-speed precise manual/automatic laser control via the NCU rapid digital output is studied. The method using analogue drive module to control laser power and micro-milling spindle is presented. By combining laser and micro-milling together, the precise machining of copper-clad polyimide with high efficiency and low cost is implemented. Experimental results indicate that this machine tool is suitable for manufacturing copper layer with a minimum width of metal removal of 50 μm and has stable performance and high reliability. She received her Bachelor degree of Vehicle Engineering from DaLian JiaoTong University in 2011. Her current research focus is about precision measurement based on micro binocular stereovision in the field of machine vision.

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Integrated 122-GHz Antenna on a Flexible Polyimide Substrate With Flip Chip Interconnect

Cited by 47 publications

References 40 publications

Bending Analysis of Polymer-Based Flexible Antennas for Wearable, General IoT Applications: A Review

Bending Analysis of Polymer-Based Flexible Antennas for Wearable, General IoT Applications: A Review

A SiGe-based fully-integrated 122-GHz FMCW radar sensor in an eWLB package

The control system for precise five-axis laser/micro-milling machine tool

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