“…These include low-temperature (de)multiplexers 10,11 , analog-to-digital and digital-to-analog converters 12,13 , lownoise amplifiers 14,15 , RF oscillators 16,17 , transimpedance amplifiers 18,19 , and digital processors 20,21 . In a DRAM-like strategy 22,23 , these cryogenic components can significantly reduce the number of electrical lines running through the host cryostat, thereby limiting the associated heat load and increasing interconnect reliability. A CMOS-based cryogenic controller operating at 3K was recently reported enabling highfidelity operations on an electron-spin two-qubit system 24 .…”