Integrated optical single-mode waveguide structures in thin glass for flip-chip PIC assembly and fiber coupling

Schwietering, Julian; Herbst, Christian; Kirsch, Oliver; Arndt-Staufenbiel, Norbert; Wachholz, Philipp; Schröder, Henning; Schuster, Martin

doi:10.1109/ectc32862.2020.00036

Cited by 10 publications

(4 citation statements)

References 38 publications

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“…We recently found a way to reduce these losses in curved sections through a simple adjustment of the layout of the diffusion mask. This idea traces itself to a work published by Fraunhofer IZM [3] employing S-bends. To avoid influencing factors such as changes of curve direction in the S-bend, in the present study for the first time, 90° curved waveguides are exhibited having zones of higher refractive index due to wider diffusion mask openings reducing the propagation loss.…”

Section: Optical Waveguide Integrationmentioning

confidence: 92%

“…In this work, we explain our "photonic System-in-Package (pSiP)"-concept and demonstrate hybrid integrated photonic systems in the millimeter size based on previous work [1,2]. Thin glass has been used for many years for new approaches for electrical-optical circuit boards and optical backplanes by embedding it in a PCB and integrating the optical waveguides into the glass [3,4,5,6]. Such glass boards host optical and electrical signal distribution, supplemented by optical free-space elements and transparent windows with or without additional beam shaping optics, hermetically sealed capping and interfaces to optical fiber links.…”

Section: Introductionmentioning

confidence: 99%

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Photonic-System-in-package (pSiP): miniaturization, panel level assembly, and optical waveguide integration in thin glass substrates

Schröder,

Kirsch,

Schwietering

2024

Optical Interconnects XXIV

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In this paper, we discuss a hybrid photonic packaging platform that reduces module size by enhancing the functionality of glass-based substrates, frames and caps featuring electrical, thermal, mechanical, and optical functions. Furthermore, the substrates can be functionalized with integrated optical waveguides by means of thermal ion exchange. New results for low loss bending's will be discussed. The packaging approach offers the possibility to integrate beam forming optics and further (optical) components within the miniaturized photonic module. This serves clients who do not want to cope with alignment of single micro-optics, which is inherently a tight tolerance process, but instead want to have a surfacemountable device that provides certain optical inputs and outputs which can be interconnected in a defined manner, i.e. a collimated beam or fiber coupling. As an example, we present modular photonic subsystems that enable complex configurations such as master oscillator power amplifier (MOPA). Panel-level manufacturing and high precision automated assembly techniques on panel-level are demonstrated. Laser-based sealing processes using metal absorption structures are demonstrated to form metallic bonds between glass layers. Singulation of the panel stack at the end of the process chain ensures streamlined handling and allows for cost effective manufacturing.

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Section: Optical Waveguide Integrationmentioning

confidence: 92%

Section: Introductionmentioning

confidence: 99%

Photonic-System-in-package (pSiP): miniaturization, panel level assembly, and optical waveguide integration in thin glass substrates

Schröder,

Kirsch,

Schwietering

2024

Optical Interconnects XXIV

Self Cite

View full text Add to dashboard Cite

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“…On straight sections, this process is characterized by its low level of optical attenuation. However, masked production can only be adjusted with higher effort and costs [14].…”

Section: Fabrication Of Integrated Waveguides In Glassmentioning

confidence: 99%

Integrated optical fluid sensor in glass

Reitz,

Leineweber,

Overmeyer

2023

Optifab 2023

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“…Based on this procedure, we developed a process running on commercial equipment, consisting of a CO 2 -laser cutting system, a sputtering system, a dip-coating system using a positive resist, and a laser direct imaging system. After starting the development on wafer level 19 using wafer sized glasses and a mask exposure for lithography, the process was first scaled up to 297 mm × 210 mm rectangular sized glass-panel with a flexible layout of the waveguides using laser direct imaging for lithography. 20 Based on this, the size of the processable panel was increased to 457 mm × 305 mm.…”

Section: Glass Integrated Waveguidesmentioning

confidence: 99%

Hybrid photonic system integration using thin glass platform technology

Schröder

Schwietering

Bottger

et al. 2021

J. Optical Microsystems

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Demand for high integration of optoelectronic and micro-optical components into micro-electronic systems for communication, computing, medical, and sensing applications is increasing. Advanced hybrid packaging technologies are used to enhance glass-based substrates featuring electrical, thermal, and optical functionalities with laser diodes, modulators, isolators, photonic integrated circuits (PIC), beam-splitting components, and micro-lenses. Such glassbased substrates can be thin glass layers on large panels or more mini-bench-like boards that can be embedded into organic printed circuit boards (PCBs). Optical fiber interconnects, connectors, and electrical-optical integration platforms are used for higher level system integration and need to be miniaturized on module and board level to fulfill decreasing channel pitch requirements. We provide background on and discuss thin glass as a suitable base material for ion exchanged waveguide panels and interposers, precise glass structuring for posts and holders, the related high precision assembly techniques, and advanced fiber interconnects. Some examples of PCB photonic integration, micro-bench optical sub-assemblies, including PIC, and 3D optical resonator packages that combine most of these approaches will be shown. © The Authors.Published by SPIE under a Creative Commons Attribution 4.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.

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Integrated optical single-mode waveguide structures in thin glass for flip-chip PIC assembly and fiber coupling

Cited by 10 publications

References 38 publications

Photonic-System-in-package (pSiP): miniaturization, panel level assembly, and optical waveguide integration in thin glass substrates

Photonic-System-in-package (pSiP): miniaturization, panel level assembly, and optical waveguide integration in thin glass substrates

Integrated optical fluid sensor in glass

Hybrid photonic system integration using thin glass platform technology

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