Digest. International Electron Devices Meeting,
DOI: 10.1109/iedm.2002.1175959
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Integrated PIN photodiodes in high-performance BiCMOS technology

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Cited by 24 publications
(19 citation statements)
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“…For chip manufacturing of the devices presented in this work no additional mask has to be introduced into the fabrication of this BiCMOS pseudo twin-well process, which is a remarkable advantage over the approaches described in (Colinge, 1986;Yamamoto, Kubo, Nakao, 1995;Fö rtsch et al, 2002). Twin-well means that this process contains an n-type well and a p-type well.…”
Section: Fabricationmentioning
confidence: 98%
See 1 more Smart Citation
“…For chip manufacturing of the devices presented in this work no additional mask has to be introduced into the fabrication of this BiCMOS pseudo twin-well process, which is a remarkable advantage over the approaches described in (Colinge, 1986;Yamamoto, Kubo, Nakao, 1995;Fö rtsch et al, 2002). Twin-well means that this process contains an n-type well and a p-type well.…”
Section: Fabricationmentioning
confidence: 98%
“…Instead of the wafer of the standard process which shows a typical doping concentrations of 10 15 cm À3 , a p þ wafer with a thick epitaxial layer with a doping concentration of only 2 Á 10 14 cm À3 is used. Unlike to (Fö rtsch et al, 2002) where even a lower doping concentration had to be achieved only a p-type epitaxial layer is used. The simulation of the photodiodes shows promising results with reduced diffusion effects.…”
Section: Fabricationmentioning
confidence: 99%
“…The integrated photodiode is a pin photodiode, similar to [4] and [5]. The pin structure can be reached with only a single minor process variation.…”
Section: The Photodiodementioning
confidence: 99%
“…Figure 1 shows the struct&e of this PIN photodiode. The thickness of the p--epitaxial layer was chosen to obtain a high dynamic quantum efficiency and a fast response not only for a red light but also for near infrared light [5]. An antiueflec-(ion coating (ARC) was applied to achieve a high quantum efficiency.…”
Section: The Photodiodementioning
confidence: 99%
“…1. It consists of the integrated PIN photodiode [9] and the variable gain TIA including CCI [10], [11], the non-grounded VCR R VCR [12], the reference voltage V REF for reverse photodiode biasing, and the non-inverting voltage amplifier. If operational amplifier's (OA's) transfer characteristic is approximated by the dominant pole p and given by A(j )=A 0 /(1+j / p ), the DC open-loop gain is A 0 >>1+R 4 /R 3 , and the output resistance R Z of the CCI's terminal Z is much larger than the largest equivalent resistance R VCRmax~1 00 k , the transimpedance T of the optical receiver is …”
Section: Basic Approachmentioning
confidence: 99%