Abstract:Conventional IC packaging requires device chips or dice to be packaged at the same level in a way we generally imagined, while newly developed and thriving 3D IC packaging utilizes skyscraper concept to stack numerous types of device chips with different functions occupying the exact same or similar footprint. This approach not only reduces overall package dimension and thickness, but also improves electronic interconnection performance, as well as provides other advantages like lower power dissipation and gre… Show more
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.