Integrated RF MEMS for Single Chip Radio

Grenier, Katia; Barber, Bradley P.; Lubecke, Victor M.; Zierdt, Mike; Safar, H.; Pons, Patrick; Gammel, P. L.

doi:10.1007/978-3-642-59497-7_354

Cited by 9 publications

(3 citation statements)

References 4 publications

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“…The integrated pHEMT-microrelay devices are fabricated using an interleaved fabrication technology. Another example of integrated RF-MEMS is being pursued by Agere Systems [141] and by Agilent [142]. Here the intention is to integrate FBARs, high-Q inductors and MEMS switches with active circuitry to yield a single-chip radio based on conventional transceiver architectures.…”

Section: Integrated Rf-memsmentioning

confidence: 99%

MEMS for wireless communications: from RF-MEMS components to RF-MEMS-SiP

Tilmans

Raedt

Beyne

2003

J. Micromech. Microeng.

220

114

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Wireless communication has led to an explosive growth of emerging consumer and military applications of radio frequency (RF), microwave and millimeter wave circuits and systems. Future personal (hand-held) and ground communications systems as well as communications satellites necessitate the use of highly integrated RF frontends, featuring small size, low weight, high performance and low cost. Continuing chip scaling has contributed to the extent that off-chip, bulky passive RF components,

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Section: Integrated Rf-memsmentioning

confidence: 99%

MEMS for wireless communications: from RF-MEMS components to RF-MEMS-SiP

Tilmans

Raedt

Beyne

2003

J. Micromech. Microeng.

220

114

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“…Inductors with spiral coils that are lifted out of the substrate plane have been reported [14], [15]. The assembly process proposed in [14] is reported to work with thin metal structures. This may limit its use in assembling spiral inductors with thick metal films (e.g., several micrometers of thickness) for the purpose of reducing series resistance.…”

Section: A Plastic Deformation Magnetic Assembly (Pdma) Processmentioning

confidence: 99%

“…However, silicon substrates are of low costs and, therefore, prove to be attractive to commercial RFIC development. Published research work for improving the performance of inductors on silicon substrates generally fall into two major categories: 1) applying micromachining technologies to separate the inductors from the substrates [6]- [13] and 2) using a post-fabrication assembly processes to tilt the inductor away from the substrate surface [14], [15].…”

Section: Introductionmentioning

confidence: 99%

Development of three-dimensional inductors using plastic deformation magnetic assembly (PDMA)

Zou

Liu

Trainor

et al. 2003

IEEE Trans. Microwave Theory Techn.

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On-chip inductors are critical for enabling portable power-efficient wireless communication systems. Existing on-chip spiral inductors based on conventional planar integrated-circuit fabrication technology suffer from substrate loss and parasitics, and have relatively large footprints. In this paper, we discuss the development of two types of on-chip three-dimensional (3-D) inductors-a vertical spiral inductor and a solenoid inductor-by using a 3-D assembly process called plastic deformation magnetic assembly. Prototype vertical spiral inductors and solenoid inductors have been fabricated and tested. Experimental results show that the vertical spiral inductors can achieve better performance and a smaller footprint than the in-plane ones.

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