Integrated sensor and electronics processing for &amp;lt;10?8 "iMEMS" inertial measurement unit components

Lewis, S.; Alie, Sameer Gul; Brosnihan, Tim; Core, C.; Core, T.; Howe, Richard C. T.; Geen, J.A.; Hollocher, D.; Judy, Michael W.; Memishian, J.; Nunan, K.; Paine, R.; Sherman, Steve; Tsang, B.; Wachtmann, B.

doi:10.1109/iedm.2003.1269242

Cited by 29 publications

(7 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…SCS was epitaxially grown in the surrounding area, and bipolar transistors and interconnects were subsequently defined [83]. The fabrication of thick SOI microstructures with integrated electronics was greatly facilitated by the introduction of a trench-refill isolation process [84], [85]. In this approach, a first DRIE step defines trenches that are refilled with oxide.…”

Section: Mems-first Processesmentioning

confidence: 99%

Single‐Chip Scanning Probe Microscopes

Sarkar

Mansour²

2015

Micro‐ and Nanomanipulation Tools

View full text Add to dashboard Cite

Scanning probe microscopes (SPMs) are the highest resolution imaging instruments available today and are among the most important tools in nanoscience. Conventional SPMs suffer from several drawbacks owing to their large and bulky construction and to the use of piezoelectric materials. Large scanners have low resonant frequencies that limit their achievable imaging bandwidth and render them susceptible to disturbance from ambient vibrations. Array approaches have been used to alleviate the bandwidth bottleneck; however as arrays are scaled upwards, the scanning speed must decline to accommodate larger payloads. In addition, the long mechanical path from the tip to the sample contributes thermal drift. Furthermore, intrinsic properties of piezoelectric materials result in creep and hysteresis, which contribute to image distortion. The tip-sample interaction signals are often measured with optical configurations that require large free-space paths, are cumbersome to align, and add to the high cost of state-of-the-art SPM systems. These shortcomings have stifled the widespread adoption of SPMs by the nanometrology community. Tiny, inexpensive, fast, stable and independent SPMs that do not incur bandwidth penalties upon array scaling would therefore be most welcome. A method to increase the quality factor (Q-factor) of flexural resonators is introduced. The method relies on an internal energy pumping mechanism that is based on the interplay between electrical, iv mechanical, and thermal effects. To the best of the author's knowledge, the devices that are designed to harness these effects possess the highest electromechanical Qs reported for flexural resonators operating in air; electrically measured Q is enhanced from ~50 to ~50,000 in one exemplary device. A physical explanation for the underlying mechanism is proposed.The design, fabrication, imaging, and tip-based lithographic patterning with the first single-chip Scanning Thermal Microscopes (SThMs) are also presented. In addition to 3 DOF scanning, these devices possess integrated, thermally isolated temperature sensors to detect heat transfer in the tip-sample region.Imaging is reported with thermocouple-based devices and patterning is reported with resistive heater/sensors. An "isothermal electrothermal scanner" is designed and fabricated, and a method to operate it is detailed. The mechanism, based on electrothermal actuation, maintains a constant temperature in a central location while positioning a payload over a range of >35μm, thereby suppressing the deleterious thermal crosstalk effects that have thus far plagued thermally actuated devices with integrated sensors.

show abstract

Section: Mems-first Processesmentioning

confidence: 99%

Single‐Chip Scanning Probe Microscopes

Sarkar

Mansour²

2015

Micro‐ and Nanomanipulation Tools

View full text Add to dashboard Cite

show abstract

“…5). The described process is compatible with Analog Device's SOIMEMS process [4,5] and can be integrated with CMOS electronics by adding some pre-and post-CMOS fabrication steps. …”

Section: Fabricationmentioning

confidence: 99%

Capacitive Bulk Acoustic Wave Silicon Disk Gyroscopes

Johari

Ayazi

2006

2006 International Electron Devices Meeting

View full text Add to dashboard Cite

This paper introduces the capacitive bulk acoustic wave (BAW) silicon disk gyroscope. The capacitive BAW disk gyroscopes operate in the frequency range of 2-8MHz, are stationary devices with vibration amplitudes less than 20nm, and achieve very high quality factors (Q) in low vacuum (and even in atmosphere), which simplifies their wafer-scale packaging. The device has lower operating voltages compared to low-frequency gyroscopes, which simplifies the interface circuit design and implementation in standard CMOS.

show abstract

“…Figure 5.27 shows a single-chip chemical sensor with mass-sensitive, capacitive, and calorimetric sensing elements. An interesting alternative was presented by Analog Devices [133]: their combination of pre-CMOS and post-CMOS processing avoids the bottleneck of the lowtemperature restrictions of post-CMOS processing, but the challenge of introducing nonstandard wafers into a CMOS fab remains.…”

Section: Post-cmos Sanda Technologymentioning

confidence: 99%

More than Moore

Zhang¹,

Roosmalen²

2009

View full text Add to dashboard Cite

Integrated sensor and electronics processing for <10?8 "iMEMS" inertial measurement unit components

Cited by 29 publications

References 4 publications

Single‐Chip Scanning Probe Microscopes

Single‐Chip Scanning Probe Microscopes

Capacitive Bulk Acoustic Wave Silicon Disk Gyroscopes

More than Moore

Contact Info

Product

Resources

About