Integrated silicon-PVF<sub>2</sub>acoustic transducer arrays

Swartz, R.G.; Plummer, J. D.

doi:10.1109/t-ed.1979.19797

Cited by 108 publications

(27 citation statements)

References 14 publications

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“…Similar approaches, but using extended gates, have been reported in the past for ultrasonic [13], pressure sensing [14]. In the extended gate approach, the gate terminal of a MOS device is connected to a large size electrode or the extended gate that is located elsewhere on the chip.…”

Section: Working Principle Of Posfet Devicementioning

confidence: 98%

POSFET tactile sensing arrays using CMOS technology

Dahiya

Adami

Collini

et al. 2013

Sensors and Actuators A: Physical

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This work presents fabrication and evaluation of novel POSFET (Piezoelectric Oxide Semiconductor Field Effect Transistor) devices based tactile sensing chip. In the newer version presented here, the tactile sensing chip has been fabricated using CMOS (Complementary Metal Oxide Semiconductor) technology. The chip consists of 4 x 4 POSFET touch sensing devices (or taxels) and both, the individual taxels and the array are designed to match spatiotemporal performance of the human fingertips. To detect contact events, the taxels utilize the contact forces induced change in the polarization level of piezoelectric polymer (and hence change in the induced channel current of MOS). The POSFET device on the chip have linear response in the tested dynamic contact forces range of 0.01-3 N and the sensitivity (without amplification) is 102.4 mV/N.

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Section: Working Principle Of Posfet Devicementioning

confidence: 98%

POSFET tactile sensing arrays using CMOS technology

Dahiya

Adami

Collini

et al. 2013

Sensors and Actuators A: Physical

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“…As a first step towards realization of tactile sensing arrays based on the above said approach, arrays of tactile sensors were developed by directly coupling thin piezoelectric polymers films to 32 taxel MEAs realized on silicon die, as shown in Fig 2. The MEAs in this case act as the extended gates of FETs devices, which are external to the chip. Somewhat similar approach is used by Swartz et al (Swartz and Plummer 1979) and Fiorillo et al (Fiorillo, Spiegel et al 1990) to develop ultrasonic sensors and by Kolasar et. al.…”

Section: Piezoelectric Polymer -Microelectrode Arrays (Mea) Based Tacmentioning

confidence: 94%

Tactile Sensing for Robotic Applications

Dahiya¹,

Valle²

2008

Sensors: Focus on Tactile Force and Stress Sensors

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“…In this structure Fig. 1a, a sheet of PVDF film is bonded to the extended gate of a MOSFET, resulting in a structure named as piezoelectric-oxide-semiconductor field-effect transistor (POSFET) [2]. Since the POSFET structure combines the active electronics with the sensing element on the same chip, it has been widely used and studied as an essential structure for piezoelectric or pyroelectric sensors [3,4].…”

Section: Acoustic Sensormentioning

confidence: 99%

MEMS Sensors for Underwater Applications

Natarajan

Kathiresan

Thomas

et al. 2014

Springer Tracts in Mechanical Engineering

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Microelectromechanical system (MEMS)-based sensors for marine environment help to realize new systems that bring enhanced levels of perception, control, and performance to sonar systems and sensors related to marine environments. Processing, assembly, packaging, testing, and manufacturing methods are all highly dictated by the intended application of MEMS devices; hence, these disciplines are being honed up to meet the demands with new materials and performance requirements across a wide spectrum of underwater applications. Five basic parameters are measured in the ocean to define its physical state: temperature, salinity, pressure, density, and velocity of sound. These can be obtained using a pressure sensor, temperature detector, and a conductivity sensor. Biologically inspired MEMS shear stress sensors comprising a piezoresistive floating element offer the potential to make flow measurements in fluid with unprecedented sensitivity, and spatial and temporal resolution. In order to get finer resolution of underwater objects in turbid waters, it is imperative to work at MHz frequencies. Different types of transducers such as CMUT, PMUT, and Helmholtz resonator are also realized by MEMS fabrication and are readily scalable in size. In addition, multiplexing, pulsing, and pre-amplifying electronics can be easily integrated on the same chip with the transducers or on a separate chip via flip-chip bonding. This allows for 1D and 2D arrays of elements to be easily steered electronically. Thus, fabrication of a large number of transducers with built-in pre-amplifiers required in a planar array configuration is possible with MEMS-based technology.

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Integrated silicon-PVF₂acoustic transducer arrays

Cited by 108 publications

References 14 publications

POSFET tactile sensing arrays using CMOS technology

POSFET tactile sensing arrays using CMOS technology

Tactile Sensing for Robotic Applications

MEMS Sensors for Underwater Applications

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Integrated silicon-PVF2acoustic transducer arrays

Cited by 108 publications

References 14 publications

POSFET tactile sensing arrays using CMOS technology

POSFET tactile sensing arrays using CMOS technology

Tactile Sensing for Robotic Applications

MEMS Sensors for Underwater Applications

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Product

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Integrated silicon-PVF₂acoustic transducer arrays