Integrated thermal modeling of heterogeneous eCubes stacked devices

Abstract

Vertical chip integration applied in heterogeneous systems is a design approach used to extend the device functionality and improve its performance. Apart from the design advancements, thermal budget of the device is constrained internal structure of the device. Internal module components limit the efficiency of device cooling. It is one of the most important concerns of vertical integration reliability. Development of vertically integrated devices requires cooperation of different partners and designers. This paper presents thermo-mechanical simulation needs and capabilities. The presented HDL approach is used for thermal modeling of the structure and high level, NDA-proof thermal simulations of modules of stacked, heterogeneous devices.

Multi-Domain Modeling and Simulations of the Heterogeneous Systems

“…While in the high power mode the maximum displacement reaches 24 µm on the edge of the structure, in the low power mode the displacement does not exceed 6 µm. The heterogeneous device oriented (Hedoris) multi-domain simulation system [10], [11] will be developed within the framework of the projects mentioned above. The Hedoris system implements the idea of the hardware description language (HDL) of the device model based on Verilog-AMS [12] language specification used for device thermal modeling.…”