Integrated Wideband 2-D and 3-D Transitions for Millimeter-Wave RF Front-Ends

Rida, A.; Margomeno, A; Lee, J S; Schmalenberg, Paul; Nikolaou, Symeon; Tentzeris, Manos M.

doi:10.1109/lawp.2010.2091714

Cited by 12 publications

(5 citation statements)

References 11 publications

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“…Despite the aforementioned LCP limitations, they are widely used as flexible substrates and have become one of the most desirable organic materials for high-frequency applications as they can withstand rises in operational frequencies and are very suitable for RFID antennas [ 82 , 83 , 84 ]. A design of series-fed two dipole antennas on the LCP substrate is presented in [ 81 ] where the bending effects on the proposed antennas are tested.…”

Section: Flexible Substrate Materials For Wearable Antennasmentioning

confidence: 99%

Bending Analysis of Polymer-Based Flexible Antennas for Wearable, General IoT Applications: A Review

et al. 2021

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Flexible substrates have become essential in order to provide increased flexibility in wearable sensors, including polymers, plastic, paper, textiles and fabrics. This study is to comprehensively summarize the bending capabilities of flexible polymer substrate for general Internet of Things (IoTs) applications. The basic premise is to investigate the flexibility and bending ability of polymer materials as well as their tendency to withstand deformation. We start by providing a chronological order of flexible materials which have been used during the last few decades. In the future, the IoT is expected to support a diverse set of technologies to enable new applications through wireless connectivity. For wearable IoTs, flexibility and bending capabilities of materials are required. This paper provides an overview of some abundantly used polymer substrates and compares their physical, electrical and mechanical properties. It also studies the bending effects on the radiation performance of antenna designs that use polymer substrates. Moreover, we explore a selection of flexible materials for flexible antennas in IoT applications, namely Polyimides (PI), Polyethylene Terephthalate (PET), Polydimethylsiloxane (PDMS), Polytetrafluoroethylene (PTFE), Rogers RT/Duroid and Liquid Crystal Polymer (LCP). The study includes a complete analysis of bending and folding effects on the radiation characteristics such as S-parameters, resonant frequency deviation and the impedance mismatch with feedline of the flexible polymer substrate microstrip antennas. These flexible polymer substrates are useful for future wearable devices and general IoT applications.

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Section: Flexible Substrate Materials For Wearable Antennasmentioning

confidence: 99%

Bending Analysis of Polymer-Based Flexible Antennas for Wearable, General IoT Applications: A Review

et al. 2021

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“…This subarray is designed on a 5 mil thick (0.127 mm) RO3003 material with dielectric constant ( r ) 3.0 and dielectric loss tangent (tan ) 0.0013. It is also to be noted that the metallization was modeled as copper with a thickness of 9 m; a common metallization thickness for mm-Wave circuitry [4]. …”

Section: A Sub-array Design 16x1mentioning

confidence: 99%

“…In order to reduce the effect of the feeding network RF 3D interconnections may be utilized [4] or simply a shielded corporate feeding such as the one shown in Figure 10 which includes an unsymmetrical strip line configuration for the corporate feeding (15 mils substrate above the microstrip line, 5 mils below it). The gain pattern in Figure 10 has a major shoulder radiation improvement when compared to that shown in Figure 8 and a slight increase in the maximum gain from 26.2dBi to 26.5dBi.…”

Section: "Shoulder" Radiation Reduction Due To Corporate Feedingmentioning

confidence: 99%

Design of low cost microstrip antenna arrays for mm-Wave applications

Rida

Tentzeris

Nikolaou

2011

2011 IEEE International Symposium on Antennas and Propagation (APSURSI)

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Abstract-A planar, low profile, low cost microstrip patch array antenna is developed in the millimeter-wave band for large gain applications. A simple edge feeding is used for a sub-array of 16x1 elements, and finally a matching network or power divider/splitter is designed for a 32x16 elements with a gain of 27dBi for the design frequency of 79GHz and 26dBi at 80GHz. A method to reduce the slightly high "shoulder" radiation due to the feed network is introduced through a shielded feed.

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“…Further, these vias are frequency-limited due to the intrinsic MOS capacitor of the TSV on HR-Si. Other interposers such as fused silica [13], [14] and liquid crystal polymer (LCP) [15], [16], [17] have also been proposed again with fabrication difficulties and limited performance. In [18], the Metallic-nanowire-Membrane (MnM) interposer is proposed as a new generation of interposer that yields high-performance and miniaturized transmission lines and vias in a simple, low-cost fabrication process, which will be reviewed in this work.…”

mentioning

confidence: 99%

Millimeter-wave Wireless Integrated Systems: what to expect for future solutions

Serrano¹,

Marcati²,

Abe³

et al. 2022

JICS

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This paper intends to make a brief presentation of in integrated circuits’ developments and efforts towards new wireless applications at the millimeter-wave frequencies band. Considering low-cost applications for the consumer market, it is shown that using only one technology is not desirable for cost and size reasons. The 3D integration becomes a necessity for the new applications in such frequencies, pushing forward alternative technologies and new 3D interconnection techniques.

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Integrated Wideband 2-D and 3-D Transitions for Millimeter-Wave RF Front-Ends

Abstract: Abstract-This

Cited by 12 publications

References 11 publications

Bending Analysis of Polymer-Based Flexible Antennas for Wearable, General IoT Applications: A Review

Bending Analysis of Polymer-Based Flexible Antennas for Wearable, General IoT Applications: A Review

Design of low cost microstrip antenna arrays for mm-Wave applications

Millimeter-wave Wireless Integrated Systems: what to expect for future solutions

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