Integrating Ultra-thin SiGe BiCMOS Power Amplifier Chip in Combination with Flexible Antenna in the Polymer Foil

Özbek, Sefa; Wang, Shuo; Fischer, Serafin B.; Burghartz, Joachim N.; Hesselbarth, Jan; Berroth, Manfred

doi:10.1109/iscas48785.2022.9937648

Cited by 1 publication

(2 citation statements)

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“…9, the measured peak gain frequency of the thinned PA on the conductor material (metal Thermo-Chuck) shifts about 600 MHz toward higher frequencies compared to the thin silicon chip on dielectric material and the thick silicon chip. The significant frequency difference is due to the image mirror current within the conducting material [19]. Despite the thin substrate of the chip, no significant S-parameter degradation was observed in the measurements realized on the dielectric material (FR4).…”

Section: Stand-alone Prototype Of the Rf-chipmentioning

confidence: 99%

“…Previous studies also evaluated the RF performance of the PA chip embedded in the polyimide foil [13]. The recent implementation of thinned Si PA on a 1 μm-thick AlSiCu heat spreader in foil substrate shows that the patterned heat spreader instead of the solid one can be used to prevent the image mirror currents induced in the heat spreader due to the magnetic field of the passives [19].…”

Section: Stand-alone Prototype Of the Rf-chipmentioning

confidence: 99%

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Adaptive triple-fed antenna and thinned RF-chip integration into ultra thin flexible polymer foil

Fischer

Özbek

Wang

et al. 2023

Int. J. Microw. Wireless Technol.

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Attaching a wireless transmission system comprising a radio frequency (RF)-chip and a dipole antenna to dielectric material of largely different permittivity leads to strong variation of the antenna feed impedance. Due to the severe impedance mismatch between the RF-chip and the antenna, the performance of the system may deteriorate drastically. The proposed antenna provides three feed points, which show respective feed-point match to 100 Ohm balanced feeds for three different dielectric environments (free-space and half-spaces of permittivity 4 and 42, respectively). Thereby, the RF-chip incorporates three 100 Ohm balanced output ports that are connected to the antenna from whom only one can be selected to provide the output signal. The respective other two output ports are shorted by an internal switching circuit that is controlled by external DC voltages. The measurement of the reflection coefficient of the stand-alone antenna and the chip agree well with the simulations, allowing to interconnect these two components. Further, the radiation pattern of the whole system is measured for two different scenarios showing good functionalities.

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Section: Stand-alone Prototype Of the Rf-chipmentioning

confidence: 99%

Section: Stand-alone Prototype Of the Rf-chipmentioning

confidence: 99%