Handbook of Thin Film Devices 2000
DOI: 10.1016/b978-012265320-9/50101-x
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Integration Aspects of Advanced Ferroelectric Thin-Film Memories

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“…Finally, the sacrificial layer was etched to form the thermal isolation structure. of merit, which was most appropriate for application to the IR detector at Zr/Ti = 30/70 [9]. To check process reliability, the ferroelectric characteristics of the functional material, i.e., a Pb(Zr 0.3 Ti 0.7 )O 3 thin film, were examined after each process step.…”
Section: Fabrication Process and Evaluation Of Monolithic Focal Planesmentioning
confidence: 99%
“…Finally, the sacrificial layer was etched to form the thermal isolation structure. of merit, which was most appropriate for application to the IR detector at Zr/Ti = 30/70 [9]. To check process reliability, the ferroelectric characteristics of the functional material, i.e., a Pb(Zr 0.3 Ti 0.7 )O 3 thin film, were examined after each process step.…”
Section: Fabrication Process and Evaluation Of Monolithic Focal Planesmentioning
confidence: 99%