2009 IEEE Workshop on Microelectronics and Electron Devices 2009
DOI: 10.1109/wmed.2009.4816141
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Integration of IC Industry Feature Sizes with University Back-End-of-Line Post Processing: Example Using a Phase-Change Memory Test Chip

Abstract: Abstract-We have demonstrated that back-end-of-line (BEOL)processing can successfully be performed in a university environment on die that have been fabricated at a foundry. This processing option enables universities to integrate state-of-the-art feature sizes with low resolution photolithography capabilities, such as achieved with a contact aligner, typically available at universities. With this capability, new device technologies and materials can be explored at the university level, where the basic researc… Show more

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Cited by 3 publications
(2 citation statements)
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“…The BEOL mask levels, process flow, and fabrication were completed at Boise State. The fabrication process used the BEOL process for memristor device integration with CMOS that has previously been established [42].…”
Section: Beol Development For Asu Ic Test Chipmentioning
confidence: 99%
“…The BEOL mask levels, process flow, and fabrication were completed at Boise State. The fabrication process used the BEOL process for memristor device integration with CMOS that has previously been established [42].…”
Section: Beol Development For Asu Ic Test Chipmentioning
confidence: 99%
“…These differences also enable the device used in this work to withstand higher fabrication (at least 300°C) and operating temperatures (operation at 150°C is routinely performed). Additionally, this device can be integrated into a back-end-of-line (BEOL) CMOS process (Regner et al, 2009) making it compatible with CMOS architectures (Serrano-Gotarredona et al, 2013b). …”
Section: Introductionmentioning
confidence: 99%