Intense pulsed light sintering of copper nanoink for printed electronics

Kim, Kwang Ho; Dhage, Sanjay R.; Shim, Dong Eun; Hahn, H. Thomas

doi:10.1007/s00339-009-5360-6

Cited by 404 publications

(273 citation statements)

References 9 publications

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“…Photonic sintering, also known as intense pulsed light [18] or (flash-assist) rapid thermal processing (RTP) [19,20], is used within the printed electronics industry today. Industrial roll-to-roll systems are already available.…”

Section: Photonic Sinteringmentioning

confidence: 99%

Applicability of photonic sintering and autoclaving as alternative contact formation methods for silicon solar cells with passivating contacts

Schube¹,

Fellmeth²,

Maier³

et al. 2018

AIP Conference Proceedings

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Section: Photonic Sinteringmentioning

confidence: 99%

Applicability of photonic sintering and autoclaving as alternative contact formation methods for silicon solar cells with passivating contacts

Schube¹,

Fellmeth²,

Maier³

et al. 2018

AIP Conference Proceedings

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“…A few approaches exist to alleviate the crack phenomenon observed. One possibility is to adopt a localised curing of the silver traces [55][56][57] such as laser sintering or the use of a xenon flash lamp. This has been adopted for the thermal sintering of silver traces on temperature sensitive substrates and is thus a possibility for fabric substrates.…”

Section: Printability and Measurable Resistancementioning

confidence: 99%

“…In addition, the use of a suitable laser source along with the optimisation of the laser sintering parameters for the ink is of critical importance [58]. Otherwise a non-ideal scalloped trace profile may result [56].…”

Section: Printability and Measurable Resistancementioning

confidence: 99%

Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces

Lim

Goh

Liu

et al. 2015

Surface and Coatings Technology

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Citation: LIM, Y.Y. ... et al, 2015. Surface modification of an ambient UVcured dielectric to realise electrically conducting traces. Surface and Coatings Technology, 266, Additional Information:• This article was accepted for publication in the journal, Surface and Coat- AbstractThere has been much interest in the printing of silver inks onto flexible substrates, for which intermediate dielectric layers are often required to achieve suitable wettability. This work seeks to realize continuous silver traces overprinted onto UV-curable dielectrics through surface modification techniques (thermal and UV-ozone post treatments), when the UV light source used for the curing is non-optimal. Two UV curable dielectric materials were deposited and the effects of curing time and curing atmosphere on the inkjet printability of a commercially available silver ink were investigated. Good wettability of the silver ink was obtained following ozone treatment of the dielectric layers, where the treatment required was found to be a function of the dielectric formulation and the curing atmosphere. Water droplet contact angle measurements were used to analyse the resulting changes in the surface conditions of the dielectric layers. The results provided an indication, but were not sufficient for predicting whether silver traces with measurable resistance could be subsequently obtained. Instead, measurable silver trace resistances were found to be influenced by the occurrence of cracks in the trace and possibly the degree of cross-linking present in the dielectric. Following these results, the authors demonstrate that electrically conductive traces can be achieved on ambient cured samples, which yields a more flexible solution compared to inert cured samples.

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“…According to this trend, the low-temperature manufacturing process has been an important issue [7][8][9][10]. To solve this, various methods have been suggested.…”

Section: Introductionmentioning

confidence: 99%

Calculating the Threshold Energy of the Pulsed Laser Sintering of Silver and Copper Nanoparticles

Lee¹,

Hahn²

2016

Journal of the Optical Society of Korea

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In this study, in order to analyze the low-temperature sintering process of silver and copper nanoparticles, we calculate their melting temperatures and surface melting temperatures with respect to particle size. For this calculation, we introduce the concept of mean-squared displacement of the atom proposed by Shi (1994). Using a parameter defined by the vibrational component of melting entropy, we readily obtained the surface and bulk melting temperatures of copper and silver nanoparticles. We also calculated the absorption cross-section of nanoparticles for variation in the wavelength of light. By using the calculated absorption cross-section of the nanoparticles at the melting temperature, we obtained the laser threshold energy for the sintering process with respect to particle size and wavelength of laser. We found that the absorption cross-section of silver nanoparticles has a resonant peak at a wavelength of close to 350 nm, yielding the lowest threshold energy. We calculated the intensity distribution around the nanoparticles using the finite-difference time-domain method and confirmed the resonant excitation of silver nanoparticles near the wavelength of the resonant peak.

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Intense pulsed light sintering of copper nanoink for printed electronics

Cited by 404 publications

References 9 publications

Applicability of photonic sintering and autoclaving as alternative contact formation methods for silicon solar cells with passivating contacts

Applicability of photonic sintering and autoclaving as alternative contact formation methods for silicon solar cells with passivating contacts

Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces

Calculating the Threshold Energy of the Pulsed Laser Sintering of Silver and Copper Nanoparticles

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