Intense pulsed light sintering of Cu nano particles/micro particles-ink assisted with heating and vacuum holding of substrate for warpage free printed electronic circuit

Ryu, Chung-Hyeon; Joo, Sung-Jun; Kim, Kwang Ho

doi:10.1016/j.tsf.2019.02.020

Cited by 30 publications

(18 citation statements)

References 36 publications

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“…The short synthesis time of 3 min indicates that microwave‐assisted Cu synthesis is a method applicable to a continuous flow microwave‐assisted reactor for industrial production [41]. The non‐aggregated Cu particles smaller than 100 nm can be applicable as a low‐cost filler material for the fabrication of electrode or conduction patterns by intense pulsed light sintering [42–44] as well as sinter chip‐bonding [31–33].…”

Section: Resultsmentioning

confidence: 99%

Effects of process parameters on Cu‐nanoparticle synthesis in tetraethylene glycol through microwave irradiation

Choi

Lee

2020

Micro & Nano Letters

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Section: Resultsmentioning

confidence: 99%

Effects of process parameters on Cu‐nanoparticle synthesis in tetraethylene glycol through microwave irradiation

Choi

Lee

2020

Micro & Nano Letters

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“…Several groups utilized mixed Cu pastes with different sizes for the IPL sintering process in the air [ 126 , 127 , 128 , 129 , 130 ]. In the IPL sintering process, Cu nanoparticle inks often face two problems: (i) the crack formation from the volume shrinkage under tensile stress on a flat substrate and (ii) the thickness limitation of fewer than 5 μm due to the high absorption efficiency of Cu nanoparticles.…”

Section: Formulation Designs In Cu-based Mixed Inks/pastesmentioning

confidence: 99%

“…Ryu et al demonstrated the optimal IPL-sintered Cu nano/microparticle (CuNP/MP) film using the vacuum pressure for substrate holding, 150 °C substrate heating, and irradiation energy, 3.5 J/cm 2 ( Figure 15 d) [ 127 ]. The IPL-sintered Cu film had a low resistivity of 6.94 μΩ·cm and 5B level of adhesion strength with almost no warpage of the PI substrate ( Figure 15 e,f).…”

Section: Formulation Designs In Cu-based Mixed Inks/pastesmentioning

confidence: 99%

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Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

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Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

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“…However, by using ink formulations that necessitate high sintering energies to maximize conductive performance, the direct underlying substrate can experience damage due to poor localized heat dissipation at the cured metallic ink and substrate interface. [13,26] As a result, careful control over the process is required, and a need for a wider processing window has been identified.…”

Section: Introductionmentioning

confidence: 99%

Boron Nitride Nanotube Coatings for Thermal Management of Printed Silver Inks on Temperature Sensitive Substrates

Wagner

Paquet

Martinez‐Rubi

et al. 2021

Adv Elect Materials

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sive, high throughput technology to integrate functional inks on low-temperature flexible substrates and to mass-fabricate electronics. A wide range of ink formulations have already been successfully incorporated into electronics using screenprinting, including flake-based ink, [7] nanowire inks, [8] nanoparticle (NP) inks, [9][10][11] and molecular inks. [12,13] Molecular inks derived from metal carboxylate salts have become a viable option to address costly or performative limitations exhibited by flake-based and NP inks. [13] They achieve high electrical performance due to their near bulk conductivity, and mechanically robust traces can be printed with low surface roughness and superior adhesion onto flexible substrates. Through the decomposition of the metal complex by means of photonic or thermal sintering, several ink formulations containing salts such as silver i) and copper ii) ethylene glycol carboxylates, and silver neodecanoate have all demonstrated a capacity to print highly conductive traces. [14][15][16] Silver neodecanoate (AgND) in particular can produce metallic traces that exhibit high current carrying capacity (CCC), low sheet resistivity, and low surface roughness upon printing. [13] Although AgND inks provide a performance-competitive alternative to particle-based inks, the high irradiative and thermal budget required to decompose and convert the ink to its metallic state necessitates a highly calibrated sintering sequence to avoid damaging the substrate.Printed electronics provide inexpensive and light weight electrical components to fuel emerging applications. One major challenge is the high temperature required to sinter conductive metal inks, which leads to thermal degradation of the substrate and subsequently poor performance. A boron nitride nanotube (BNNT) interfacial film is reported for thermal management in rapid processing of a printable silver molecular ink platform using intense pulsed light (IPL) sintering techniques. The inclusion of BNNT thin films of varying surface concentrations deposited between the substrate and the printed features reduces thermal damage to the substrate during sintering while simultaneously improving electrical performance, achieving a sheet resistance value as low as 140 mΩ sq −1 . A wide range of sintering energies ranging from 2.0 and 3.2 J cm −2 are investigated along with printed trace widths ranging from 5 mil (0.127 mm) to 20 mil (0.508 mm). Increases in the rate of cooling and in the current carrying capacity are confirmed with the inclusion of the BNNTs. Overall the thin coating of BNNTs presents no drawbacks while significantly improving the electrical properties of IPL sintered conductive traces and thus represents a simple approach that will advance the adoption of IPL for fabricating printed electronic components.

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Intense pulsed light sintering of Cu nano particles/micro particles-ink assisted with heating and vacuum holding of substrate for warpage free printed electronic circuit

Cited by 30 publications

References 36 publications

Effects of process parameters on Cu‐nanoparticle synthesis in tetraethylene glycol through microwave irradiation

Effects of process parameters on Cu‐nanoparticle synthesis in tetraethylene glycol through microwave irradiation

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Boron Nitride Nanotube Coatings for Thermal Management of Printed Silver Inks on Temperature Sensitive Substrates

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