2013
DOI: 10.1016/j.jeurceramsoc.2012.07.029
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Inter-diffusion between NiCuZn-ferrite and LTCC and its influence on magnetic performance

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Cited by 14 publications
(9 citation statements)
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“…In our previous study [10], the chemical composition across the interface between NiCuZn ferrites and LTCC after cofiring at 900 • C for 2 h was investigated and observed that no obvious element inter-diffusion of Ni, Zn, Fe, Al and Si was observed at the interface. Only a small concentration of copper ions from the ferrite can diffuse into the LTCC at a distance of around 10 m, which is consistent with the observations of Lee et al [11]. This may be due to the formation of copper-rich precipitates during NiCuZn ferrite sintering attributed to the sintering process being faster than oxygen diffusion from the outside into the pores [19].…”
Section: Methodssupporting
confidence: 90%
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“…In our previous study [10], the chemical composition across the interface between NiCuZn ferrites and LTCC after cofiring at 900 • C for 2 h was investigated and observed that no obvious element inter-diffusion of Ni, Zn, Fe, Al and Si was observed at the interface. Only a small concentration of copper ions from the ferrite can diffuse into the LTCC at a distance of around 10 m, which is consistent with the observations of Lee et al [11]. This may be due to the formation of copper-rich precipitates during NiCuZn ferrite sintering attributed to the sintering process being faster than oxygen diffusion from the outside into the pores [19].…”
Section: Methodssupporting
confidence: 90%
“…The cofiring behavior and interfacial structure of LTCC/NiCuZn ferrite laminates were recently investigated [2,[10][11][12][13]. In our previous study large pores and air gaps occurred at the interface between NiCuZn ferrites containing Bi 2 O 3 and LTCC after cofiring at 900 • C for 2 h. This is due to widening of the shrinkage mismatch between NiCuZn ferrites and LTCC resulting from Bi 2 O 3 in NiCuZn ferrites diffusion into LTCC.…”
Section: Introductionmentioning
confidence: 99%
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“…Ferrites are the most sought materials in the fabrication of electronic devices due to their desirable electrical, magnetic and dielectric properties. [1][2][3] In the fabrication of MLCI, NiCuZn ferrites are used because of the excellent magnetic properties in the high frequency, and can be sintered below the melting point of Ag (around 961°C). NiCuZn ferrites are stacked alternately with the conducting inner electrode, usually silver paste, and then co-fired to obtain monolithic structure.…”
Section: Introductionmentioning
confidence: 99%
“…However, LiZnTi ferrites do not meet the basic requirements with regard to sinterability for LTCC technology since they have relatively high sintering temperature [5][6][7]. The addition of borosilicate glasses is an effective way to decrease the firing temperature in LTCC materials [8][9][10][11][12][13][14]. Those glasses exhibit a softening point of $700°C and have a crucial influence on the viscosity of the melt during the firing as described by the Mauro-Yue-Ellison-Gupta-Allan (MYEGA) equation [15]: log 10 gðTÞ ¼ log 10 g 1 þ ð12 À log 10 g 1 Þ Tg T exp m 12Àlog 10 g 1 À 1 h Tg T À 1 i ; where T g is the glass-transition temperature, defined by log 10 gðT g Þ ¼ 10 12 Pa s [16], m is the liquid fragility index, defined by m ¼ @log 10 gðTÞ @ðTg=TÞ T¼Tg [17].…”
Section: Introductionmentioning
confidence: 99%