Interaction between Screw Dislocation and Interfacial Crack in Fine-Grained Piezoelectric Coatings under Steady-State Thermal Loading

Abstract

The mechanical behavior of fine-grained piezoelectric/substrate structure with screw dislocation and interface edge crack under the coupling action of heat, force and electricity are studied. Using the mapping function method, firstly, the finite area plane is transformed into the right semi-infinite plane, then the expression of the temperature field is given with the help of the complex function, and then the temperature field of the problem is achieved. By constructing the general solution of the governing equation with temperature function, the analytical expression of the image force is derived. Finally, the effects of material parameters, temperature gradient, coating thickness and crack size on image force are analyzed by numerical examples. The results show that the temperature gradient has a very significant effect on the image force, and thicker coating is conducive to the stability of dislocation and interface crack.

Analysis of an Interface Crack between Piezoelectric Semiconductor Coating and Elastic Substrate Structure

“…[25,26], an extended finite element method and meshless method based on the local Petrov-Galerkin method were proposed to analyze the interface cracks problem between piezoelectric materials. The mechanical behavior of fine-grained piezoelectric/substrate structures with spiral dislocations and interface edge cracks under multi field coupling were studied in [27]. The interface crack model with a contact zone at the crack tip was established and transformed into a Dirichlet and Riemann boundary value problem to obtain a solution [28,29].…”