2005
DOI: 10.1016/j.apsusc.2004.12.013
|View full text |Cite
|
Sign up to set email alerts
|

Interaction of anti-adhesive silicone films with UV embossing resin

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
8
0
1

Year Published

2011
2011
2022
2022

Publication Types

Select...
8
1

Relationship

0
9

Authors

Journals

citations
Cited by 12 publications
(9 citation statements)
references
References 14 publications
0
8
0
1
Order By: Relevance
“…然而, 在实际成 形过程中, 抗黏涂层存在转移和老化现象, 脱模效果 逐步降低. Yan等人 [37] 采用不同分子式的有机硅作为 模具抗黏涂层, X射线光电子光谱分析追踪硅膜和 PEGDA模具的表面化学成分, 发现随着模具使用次 数的增加, 硅会从硅膜往模具上转移. Houle等人 [38] 通过黏接和化学测试法分析了抗黏涂层和UV胶的反 应, 发现减少抗黏涂层和胶层之间的反应有利于提 高抗黏涂层耐久性.…”
Section: 为提高脱模能力 通常在模具和胶层间添加抗unclassified
“…然而, 在实际成 形过程中, 抗黏涂层存在转移和老化现象, 脱模效果 逐步降低. Yan等人 [37] 采用不同分子式的有机硅作为 模具抗黏涂层, X射线光电子光谱分析追踪硅膜和 PEGDA模具的表面化学成分, 发现随着模具使用次 数的增加, 硅会从硅膜往模具上转移. Houle等人 [38] 通过黏接和化学测试法分析了抗黏涂层和UV胶的反 应, 发现减少抗黏涂层和胶层之间的反应有利于提 高抗黏涂层耐久性.…”
Section: 为提高脱模能力 通常在模具和胶层间添加抗unclassified
“…Curing of the composition and formation of the coating consists in the formation of interpenetrating polymer networks [12,13]. Silicone-epoxy resins are readily co-cured with silicone-amine and silicone-acrylic ones, especially under UV-irradiation [14,15]. Silicone resins modified with acrylic monomers and isocyanates, as well as silicone resins containing terminal vinyl groups able to cure with nitrile compounds, are interesting materials [16][17][18].…”
Section: Badanie Stabilnooeci Termicznej ¿Ywic Glicydylosiloksanowychmentioning
confidence: 99%
“…64,65 After the pioneering work on nanoimprint lithography (NIL) by Chou et al demonstrating patterns of 25 nm diameter holes in a PMMA film and the subsequent fabrication of metal pillars by metal deposition and lift-off, 64,65 considerable efforts have been devoted to overcome many challenges associated with NIL. Such efforts include understanding fundamentals related to the process, such as polymer flow behavior during molding and stress and deformation of molded polymers during demolding, [66][67][68][69][70][71][72][73][74][75][76][77][78][79][80][81][82][83] developing optimal materials applicable to the NIL process, [84][85][86][87][88][89][90][91][92][93][94][95] overcoming the overlay issue, [96][97][98][99][100][101][102][103][104] fabricating reliable stamps with sub-100 nm features, [105][106]…”
Section: Introduction To Nanomoldingmentioning
confidence: 99%