“…Therefore, the distances between the pores as vacancy sources and the grain boundaries, which act as vacancy sinks, are large. This phenomenon is well discussed in the literature concerning sintering processes of metals and ceramics [19–21]. Figure 6 Sintering curve of Cu powder green bodies with initial green density of 70%, sintered at 1075 °C for 3 h in an H 2 atmosphere.…”
Section: Resultsmentioning
confidence: 57%
“…Therefore, the distances between the pores as vacancy sources and the grain boundaries, which act as vacancy sinks, are large. This phenomenon is well discussed in the literature concerning sintering processes of metals and ceramics [19][20][21].…”
Section: Microstructure Development During Sinteringmentioning
Copper as a material with a high electrical and thermal conductivity awakes large interest for many applications in industry, e.g. thermal management of electronic components. Powderbased manufacturing techniques (e.g. Selective Laser Melting, Binder Jetting, Fused Filament Fabrication and Metal Injection Molding) enable the complex shaping of metals. Especially the methods without melting processes like Binder Jetting, Fused Filament Fabrication and Metal Injection Molding have a great potential for complex Cu structures. These techniques built up a powder-based green body and require a subsequent sintering step to reach a high density with maximum properties. This work reports the development of the heat conductivity during pressure-less sintering of Cu powder green bodies. The experimental results are compared to analytical models and a numerical simulation and show the limits of the reachable heat conductivity depending on the remaining porosity and the impurity concentration.
“…Therefore, the distances between the pores as vacancy sources and the grain boundaries, which act as vacancy sinks, are large. This phenomenon is well discussed in the literature concerning sintering processes of metals and ceramics [19–21]. Figure 6 Sintering curve of Cu powder green bodies with initial green density of 70%, sintered at 1075 °C for 3 h in an H 2 atmosphere.…”
Section: Resultsmentioning
confidence: 57%
“…Therefore, the distances between the pores as vacancy sources and the grain boundaries, which act as vacancy sinks, are large. This phenomenon is well discussed in the literature concerning sintering processes of metals and ceramics [19][20][21].…”
Section: Microstructure Development During Sinteringmentioning
Copper as a material with a high electrical and thermal conductivity awakes large interest for many applications in industry, e.g. thermal management of electronic components. Powderbased manufacturing techniques (e.g. Selective Laser Melting, Binder Jetting, Fused Filament Fabrication and Metal Injection Molding) enable the complex shaping of metals. Especially the methods without melting processes like Binder Jetting, Fused Filament Fabrication and Metal Injection Molding have a great potential for complex Cu structures. These techniques built up a powder-based green body and require a subsequent sintering step to reach a high density with maximum properties. This work reports the development of the heat conductivity during pressure-less sintering of Cu powder green bodies. The experimental results are compared to analytical models and a numerical simulation and show the limits of the reachable heat conductivity depending on the remaining porosity and the impurity concentration.
“…Results are shown in The grain growth inhibition observed in the temperature range of 1000 to 1100c C may be explained in terms of theépin-ningêeffect of pores present on grain boundaries. 19 A rapid grain growth above 1100c C results in the entrapment of pores within grains, thereby accelerating the grain growth. On the basis of the above results, therefore, we conclude that the optimum firing temperature and time for the fabrication of dense and fine-grained ceramics are 1100c C and 5 h, respectively.…”
Section: Densification Of Hap Compact During the Firingmentioning
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