2017
DOI: 10.1116/1.4977566
|View full text |Cite
|
Sign up to set email alerts
|

Interaction study of nitrogen ion beam with silicon

Abstract: Focused ion beam technology with light gas ions has recently gained attention with the commercial helium and neon ion beam systems. These ions are atomic, and thus, the beam/sample interaction is well understood. In the case of the nitrogen ion beam, several questions remain due to the molecular nature of the source gas, and in particular, if and when the molecular bond is split. Here, the authors report a cross-sectional scanning transmission electron microscopy (STEM) study of irradiated single crystalline s… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
4
0

Year Published

2017
2017
2022
2022

Publication Types

Select...
4
1

Relationship

3
2

Authors

Journals

citations
Cited by 5 publications
(4 citation statements)
references
References 28 publications
0
4
0
Order By: Relevance
“…The helium atom of the atomic He + ion has one positive charge, whereas the two nitrogen atoms of the molecular ion share the charge and are connected by a covalent bond. The nitrogen bond has a dissociation energy of 9.8 eV and is readily broken when the ion interacts with the substrate, but not during the field ionization process (Schmidt et al, 2017). As mentioned earlier, ions can generate SEs by KEE and PEE, respectively.…”
Section: Discussionmentioning
confidence: 99%
“…The helium atom of the atomic He + ion has one positive charge, whereas the two nitrogen atoms of the molecular ion share the charge and are connected by a covalent bond. The nitrogen bond has a dissociation energy of 9.8 eV and is readily broken when the ion interacts with the substrate, but not during the field ionization process (Schmidt et al, 2017). As mentioned earlier, ions can generate SEs by KEE and PEE, respectively.…”
Section: Discussionmentioning
confidence: 99%
“…We did not analyze any damage around the processing line in this study, but we think that there may have been ion irradiation effects such as amorphousization of GaAs and/or doping of nitrogen into Nb and GaAs within several 10's of nm around the line. 22) However, we think that the amorphousization and doping do not interfere with JJ formation, because the GaAs underneath Nb is not important and the Nb doped with nitrogen forms an NbN superconductor. The line width is smaller than in the Ne GFIS-FIB case, 18) but three times as large as in the He GFIS-FIB case.…”
Section: Device Fabricationmentioning
confidence: 99%
“…17,18) We have focused on GFIS-FIB utilizing nitrogen gas (N 2 GFIS-FIB), which can etch directly at the 10 nm level or finer. 19) Some applications of N 2 GFIS-FIB have been reported, such as secondary ion imaging, 20) photomask repair, 19,21) ion implantation into silicon, 22) and fabrication of quantum point contacts. 23) In this study, we performed single-line etching of Nb thin films by N 2 GFIS-FIB and fabricated JJ devices.…”
Section: Introductionmentioning
confidence: 99%
“…Factors limiting the accuracy of the MC simulation method is the fact that each "shot" is performed onto a pristine target (i.e., no accumulation of damage), and it requires experimental data to model the particle-medium interaction as precisely as possible. SRIM is one software package for MC simulation that has proven useful for many cases [36], but other MC codes exist [37,38].…”
Section: Field Ionization Of Molecular Nitrogen Gas and Solid-ion Intmentioning
confidence: 99%