Interactions, joining and microstructure of Sn-Ti/ZrO2 system

Wang, Fu; Song, Xiaoguo; Passerone, A.; Hu, Shengpeng; Bian, Hong; Wang, Meirong

doi:10.1016/j.jeurceramsoc.2018.12.010

Cited by 33 publications

(14 citation statements)

References 39 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The Ti‐O compound can strengthen the interfacial bonding for the very large value of W ad . In reference 13, ZrO 2 ceramic was soldered with Sn‐Ti filler and the Ti 2 O 3 layer was identified at the interface. Ag and Cu elements were also added into the Sn‐Ti alloys in reference 14.…”

Section: Discussionmentioning

confidence: 99%

See 1 more Smart Citation

Study on the effect of Ti, Al, Cu, and Ag doping on the bonding properties of soldered β‐Sn(100)/ZrO₂(111) interface

Guo

She

Xue

et al. 2020

Int J Applied Ceramic Tech

View full text Add to dashboard Cite

Selecting active elements for filler metal is very important in soldering of ZrO 2 ceramics. In this paper, the effects of Ti, Al, Cu, and Ag active elements on the bonding strength and electronic structures of soldered β-Sn(100)/ZrO 2 (111) interface were studied via the method of first principle calculation. The work of adhesion (W ad) results show that the O 2-terminated interface is more stable than other kinds of interfaces. Then, the atoms of Ti, Al, Cu, and Ag were doped into the interface by replacing the Sn atom in situ. It is found that additions of Ti, Al, and Cu atoms can increase the W ad , and Ag atom has the opposite effect. From the results of heat of segregation, doping Ti and Al into the interface is stable in thermodynamics and doping Cu and Ag is not stable. The forming of strong ionic-covalent Ti-O and Al-O bonding contributes to the increase of the interfacial adhesion strength. The calculation results indicate that Ti and Al can act as active elements in Sn to solder ZrO 2. The Ti-O and Al-O compounds formed at interface can improve the wetting and bonding between Sn-based solder and ZrO 2 ceramics.

show abstract

Section: Discussionmentioning

confidence: 99%

“…Ti is a commonly used active element in soldering oxide ceramic for its high activity 12 . Fu 13 realized sound ZrO 2 joints with Sn‐4Ti and Sn‐8Ti (wt%) fillers. Interlayers of Ti 2 O 3 and Ti 11.31 Sn 3 O 10 were identified at the interface.…”

Section: Introductionmentioning

confidence: 99%

Study on the effect of Ti, Al, Cu, and Ag doping on the bonding properties of soldered β‐Sn(100)/ZrO₂(111) interface

Guo

She

Xue

et al. 2020

Int J Applied Ceramic Tech

View full text Add to dashboard Cite

show abstract

“…1113) However, the interface reaction transition layer maybe harmful to the bonding strength, thermal fatigue and other joint properties. Song 14) studied brazing of ZrO 2 used SnTi alloys with the brazing temperature of 1000°C and holding time of 10 min, and the shear strength located in the range of 2228 MPa, which the joint fractured through ¢-Sn matrix owing to its weakness.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Property of ZrO<sub>2</sub> Joint Direct Brazed with Aluminum

Shang

et al. 2020

Mater. Trans.

View full text Add to dashboard Cite

In order to realize direct brazing ZrO 2 with Al, a kind of sputtering Ni/Al double layer on Al solder surface was used. Results showed that ZrO 2 could directly brazed to Al solder with sputtering Ni/Al double layer without interface reaction. And then direct brazing was investigated with the change of brazing temperature. Microstructure and joint strength of brazing seam were analyzed. Results showed that joint strength of brazing seam increased from 68.6 MPa to 121.2 MPa with the increasement of brazing temperature from 680°C to 840°C, when the brazing temperature increased up to 920°C, the joint strength gradually increased to 122.6 MPa. With the joint strength enhancement of brazing seam, the fracture of the joint is gradually transferred from interface to the brazing seam.

show abstract

“…We have shown that the Sn-Ti alloy with a Ti content of less than 6% can react with quartz glass at welding temperature to form a compact interfacial layer [9]. Studies on Sn-Ti alloy have been widely reported [10][11][12][13][14][15][16][17][18][19][20][21][22], and Sn-Ti alloy has been used to weld sapphire, diamond grits, zirconia or Poly-Crystalline CVD Diamond Plates in recent years [18][19][20][21][22]. However, almost no reports have focused on Sn-Ti alloy for quartz glass-metal welding except for our previous work [9].…”

Section: Introductionmentioning

confidence: 99%

Removal Mechanism of Oxide Layer on the Surface of Sn-0.4Ti Alloy for Quartz Glass Sealing

Hao

et al. 2020

Materials

View full text Add to dashboard Cite

The oxide layer on the surface of Sn-0.4Ti alloy and its removal mechanism were investigated by coalitional analyses, using XPS and TEM technologies. The results show that a compact SnO1.65 oxide layer of less than 4 nm in thickness exists on the surface of Sn-0.4Ti alloy. A large number of TiO2 nanoparticles with scale of several to tens of nanometers were grown in Sn-0.4Ti matrix by depleting SnO1.65 while welding at 800 °C. These nanoparticles were adhered to the interfacial layer between Sn-0.4Ti alloy and quartz glass, which was formed by the reaction of Sn-0.4Ti and SiO2 after SnO1.65 removal from the Sn-0.4Ti. This work may promote further works on Sn-Ti design to further improve the welding quality between Sn-Ti alloy and quartz glass, and also provide a feasible research idea to remove the oxide layer on the surfaces of solders.

show abstract

Interactions, joining and microstructure of Sn-Ti/ZrO2 system

Cited by 33 publications

References 39 publications

Study on the effect of Ti, Al, Cu, and Ag doping on the bonding properties of soldered β‐Sn(100)/ZrO₂(111) interface

Study on the effect of Ti, Al, Cu, and Ag doping on the bonding properties of soldered β‐Sn(100)/ZrO₂(111) interface

Microstructure and Property of ZrO<sub>2</sub> Joint Direct Brazed with Aluminum

Removal Mechanism of Oxide Layer on the Surface of Sn-0.4Ti Alloy for Quartz Glass Sealing

Contact Info

Product

Resources

About

Interactions, joining and microstructure of Sn-Ti/ZrO2 system

Cited by 33 publications

References 39 publications

Study on the effect of Ti, Al, Cu, and Ag doping on the bonding properties of soldered β‐Sn(100)/ZrO2(111) interface

Study on the effect of Ti, Al, Cu, and Ag doping on the bonding properties of soldered β‐Sn(100)/ZrO2(111) interface

Microstructure and Property of ZrO<sub>2</sub> Joint Direct Brazed with Aluminum

Removal Mechanism of Oxide Layer on the Surface of Sn-0.4Ti Alloy for Quartz Glass Sealing

Contact Info

Product

Resources

About

Study on the effect of Ti, Al, Cu, and Ag doping on the bonding properties of soldered β‐Sn(100)/ZrO₂(111) interface

Study on the effect of Ti, Al, Cu, and Ag doping on the bonding properties of soldered β‐Sn(100)/ZrO₂(111) interface