1999
DOI: 10.1002/(sici)1521-396x(199901)171:1<133::aid-pssa133>3.0.co;2-d
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Interactions of Moving Dislocations in Semiconductors with Point, Line and Planar Defects

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Cited by 36 publications
(19 citation statements)
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“…These TDs then run through the layer progressively relieving the misfit strain. The residual gliding force on them decreases and they eventually stop encountering other defects or local stress field fluctuations [5][6][7]. By appropriate annealing procedures this relaxation process can be pushed toward nearly the full relaxation of the layer, with the final dislocation microstructure resulting in a nearly perfectly-ordered network of MDs placed at the heterointerface [8], approaching the thermodynamic minimum-energy configuration [9].…”
Section: Introductionmentioning
confidence: 99%
“…These TDs then run through the layer progressively relieving the misfit strain. The residual gliding force on them decreases and they eventually stop encountering other defects or local stress field fluctuations [5][6][7]. By appropriate annealing procedures this relaxation process can be pushed toward nearly the full relaxation of the layer, with the final dislocation microstructure resulting in a nearly perfectly-ordered network of MDs placed at the heterointerface [8], approaching the thermodynamic minimum-energy configuration [9].…”
Section: Introductionmentioning
confidence: 99%
“…Even with the surface sensitivity of ECCI, its ability to observe thick epitaxial layers with realistic strain states differentiates it from other in situ techniques. Previous work has modeled thread-misfit interactions thought to be typical during semiconductor growth [33,34], and further studies directly observed these interactions using in situ TEM [35,36]. ECCI enables the extension of this research to samples of bulk thickness, where thread-thread interactions might dominate dislocation pinning.…”
mentioning
confidence: 82%
“…The results presented in this paper are from a Si 0.7 Ge 0.3 /Si(100) structure with a 30 nm mean film thickness and surface undulations of ∼70 nm wavelength and ∼3 nm amplitude, grown by molecular beam epitaxy at 525 • C and 1Å s −1 growth rate. As grown this film has a very low dislocation density due to the sluggish dislocation kinetics that exist in this system under these growth conditions [13,14], and most of the lattice mismatch stress in the film is retained. Thus on annealing in situ in the TEM, further dislocation propagation occurs, driven by the local excess stress in the film.…”
Section: Experimental and Simulation Detailsmentioning
confidence: 99%
“…In our previous work [14], the following relationship was established between measured misfit dislocation velocity (υ m ) and stress:…”
Section: Introductionmentioning
confidence: 99%