Interchain ordering structure and main chain conformation analysis of thermal stability in vinyl-addition polynorbornene

Kai, Hideki; Izumi, Atsushi; Hayakawa, Shun; Niemiec, J. Alex; Ebner, Carl; Schofield, M J; Skilskyj, Doug; Rhodes, Larry F.

doi:10.1016/j.polymer.2022.125260

Polymer

2022

DOI: 10.1016/j.polymer.2022.125260

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Interchain ordering structure and main chain conformation analysis of thermal stability in vinyl-addition polynorbornene

Hideki Kai

Atsushi Izumi

Shun Hayakawa

et al.

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2024

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Cited by 2 publications

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Crosslinking Vinyl‐Addition Polynorbornenes via Difunctional Diazirines to Generate Low Dielectric‐Constant and Low Dielectric‐Loss Thermosets

Kandanarachchi,

Meyer,

Musolino

et al. 2024

Macromol. Rapid Commun.

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Thermosets having low dielectric constant (Dk < 3) and low dielectric dissipation factor (Df < 0.003), high glass transition temperature (Tg > 150 °C), and good adhesion to copper are desirable for the low loss layers of the copper clad laminates (CCL) in next generation printed circuit boards. Three different difunctional diazirines are evaluated for both thermal and photochemical crosslinking of a high Tg vinyl‐addition polynorbornene resin: poly(5‐hexyl‐1‐norbornene) (poly(HNB)). The substrate polymer, crosslinked by the carbenes generated from the activated diazirines, forms thermosets with Dk < 2.3 and Df < 0.001 at 10 GHz depending on the identity of the diazirine and the loading. The Dk and Df values for one composition are stable for 1600 h at 125 °C in air and for 1400 h at 85 °C and 85% relative humidity, suggesting good long‐term reliability of this thermoset. Adhesion of poly(HNB) to copper can be enhanced by priming the copper surface with a diazirine prior to high temperature lamination; peel strength values of greater than 7.5 N cm−1 are achieved. Negative‐tone photopatterning of poly(HNB) with diazirines upon exposure to 365 nm light is demonstrated.

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Crosslinking Vinyl‐Addition Polynorbornenes via Difunctional Diazirines to Generate Low Dielectric‐Constant and Low Dielectric‐Loss Thermosets

Kandanarachchi,

Meyer,

Musolino

et al. 2024

Macromol. Rapid Commun.

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Multiscale Modeling of Vinyl-Addition Polynorbornenes: The Effect of Stereochemistry

Shahidi,

Laub,

Vogiatzis

et al. 2024

Polymers

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Vinyl-addition polynorbornenes are candidates for designing high-performance polymers due to unique characteristics, which include a high glass transition temperature associated with a rigid backbone. Recent studies have established that the processability and properties of these polymers can be fine-tuned by using targeted substitutions. However, synthesis with different catalysts results in materials with distinct properties, potentially due to the presence of various stereoisomers that are difficult to quantify experimentally. Herein, we develop all-atom models of polynorbornene oligomers based on classical force fields and density functional theory. To establish the relationship between chemical architecture, chain conformations, and melt structure, we perform detailed molecular dynamics simulations with the fine-tuned atomistic force field and propose simpler coarse-grained descriptions to address the high molecular weight limit. All-atom simulations of oligomers suggest high glass transition temperatures in the range of 550–600 K. In the melt state (800 K), meso chains form highly rigid extended coils (C∞≈11) with amorphous structural characteristics similar to the X-ray diffraction data observed in the literature. In contrast, simulations with racemo chains predict highly helical tubular chain conformations that could promote assembly into crystalline structures.

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Interchain ordering structure and main chain conformation analysis of thermal stability in vinyl-addition polynorbornene

Cited by 2 publications

References 21 publications

Crosslinking Vinyl‐Addition Polynorbornenes via Difunctional Diazirines to Generate Low Dielectric‐Constant and Low Dielectric‐Loss Thermosets

Crosslinking Vinyl‐Addition Polynorbornenes via Difunctional Diazirines to Generate Low Dielectric‐Constant and Low Dielectric‐Loss Thermosets

Multiscale Modeling of Vinyl-Addition Polynorbornenes: The Effect of Stereochemistry

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