2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2022
DOI: 10.1109/epeps53828.2022.9947108
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Interconnect Modeling using a Surface Admittance Operator Derived with the Fokas Method

Abstract: In this contribution, we propose a novel approach to rigorously model interconnect structures with an arbitrary convex polygonal cross-section and general, piecewise homogeneous, material parameters. A full-wave boundary integral equation formulation is combined with a differential surface admittance approach, invoking an extended form of the numerically fast Fokas method to construct the pertinent operator. Several examples validate our method and demonstrate its applicability to per-unit-of-length resistance… Show more

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Cited by 3 publications
(15 citation statements)
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“…the wavelength. We briefly summarize the main results of [21] in Section II-A and demonstrate the novel, Fokas-based solution of the capacitance problem in Section II-B.…”
Section: Formulation Of the Methodsmentioning
confidence: 99%
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“…the wavelength. We briefly summarize the main results of [21] in Section II-A and demonstrate the novel, Fokas-based solution of the capacitance problem in Section II-B.…”
Section: Formulation Of the Methodsmentioning
confidence: 99%
“…As such, the DtN matrix D in the Legendre domain is determined. Note that the λ-values (26) are optimized for the Laplace equation [24] and differ from the set used for the inductance problem [21]. More specifically, for each side m, the associated collocation points λ are chosen such that the terms pertaining to this particular side are dominant in (24).…”
Section: Construction Of the Dtn Operator For The Capacitance Problemmentioning
confidence: 99%
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