Interconnect Quality and Reliability of 3D Packaging

Intermetallics Disappearance Rates and Intrinsic Diffusivities Ratios Analysis in the Cu-Zn and the Cu-Sn Systems

“…The soldered copper/tin based contacts are the weakest part of the chip that can be related to intermetallics and the Kirkendall-Frenkel porosity formation in the contact zone [3,4,7]. One of the most common reasons for chip failure is the soldered.…”