Interconnect Reliability Considerations in Portable Consumer Electronic Products

Canumalla, S.; Viswanadham, Puligandla

doi:10.1007/0-387-32989-7_30

Cited by 5 publications

(5 citation statements)

References 56 publications

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“…During the operation of FBGA devices the thermal cycles cause fractures. The thermal co-efficient difference between the FBGA package device and the printed circuit board causes cracks in the solder ball and these cracks grow into fractures over time [10]. If the solder balls surrounding the fractured solder ball have intact connection, the force of surrounding solder balls will keep the fractured solder ball faces in contact with each other.…”

Section: Intermittent Fracture In Fbga Solder Ballmentioning

confidence: 99%

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DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package

et al. 2021

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This paper shows that an intermittent AC coupling defect occurring in a DDR4 data channel will cause more intermittent errors in DDR4, compared to such defect in DDR3. The intermittent AC coupling defect occurs due to intermittent fracture in DDR4 package solder ball. The defect causes DC offset in DDR4, which shifts the data signal or data eye and results in DDR4 data channel failure. The DC offset occurs due to the asymmetric nature of pseudo open drain termination scheme. DDR4 data channel response is compared with DDR3 channel. It is shown that pseudo random binary sequence (PRBS) pattern will always cause failure for DDR4, but PRBS will only cause failure in DDR3 if the sequence of consecutive 0's or 1's in PRBS pattern is long enough to cause threshold violation. As a result there will be more intermittent errors in DDR4 compared to DDR3. The defect due to fracture in solder ball is modelled by an AC coupling capacitor. A 1nF AC coupling capacitor corresponding to a solder ball fracture of height about 1nm is used to show the difference between DDR4 and DDR3 response.

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Section: Intermittent Fracture In Fbga Solder Ballmentioning

confidence: 99%

“…They have better parasitic characteristics and high form factor [6] [7]. FBGA solder balls develop fractures due to difference in thermal expansion coefficients of the FBGA package and printed circuit board material [8][9] [10]. The fracture is modelled by an AC coupling capacitor.…”

Section: Introductionmentioning

confidence: 99%

DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package

et al. 2021

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“…Phones and other handheld, portable electronic products are subjected to severe mechanical loads when dropped onto a hard surface from heights ranging from 0.5 m to 1.5 m [1]. These drop-impact events are somewhat random in real life with regard to the magnitude of the loads and orientation of the impact.…”

Section: Introductionmentioning

confidence: 99%

“…In recent years, a large body of literature has been devoted to understanding the mechanics of solder joint fracture for CSPs and other area array components such as land grid array (LGA) packages (see [1] for references). Industry standards are also used to help the original equipment manufacturers (OEMs) assess the susceptibility of their products to failure under drop-impact loading [2].…”

Section: Introductionmentioning

confidence: 99%

Robust design of third level packaging in portable electronics: Solder joint reliability under dynamic mechanical loading

Canumalla

2008

2008 58th Electronic Components and Technology Conference

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Solder joint reliability issues that can be identified only at the system level are notoriously difficult to resolve in a timely manner using trial and error experimentation alone. The particular case of solder joint reliability of a side switch in a phone subjected to drop-impact is addressed. An approach employing Response Surface Methodology (RSM) is proposed to solve reliability and robust design problems in advanced packaging. In particular, a 10x improvement in the drop test failure rate is demonstrated with a minimum of trial and error experimentation. Technical contributions are a) a novel drop life response function derived from strain energy principles, and b) an approach to address package reliability issues at the system level. NomenclatureThe different variables in the model are: r max δ maximum extension of the rod under dynamic loading s max δ extension of the spring under dynamic loading L EA k r = is the constant of the rod with Young's modulus E, cross sectional area A and length L s k spring constant of the spring s s st k Mg = δ is extension of the spring under static loading r r st k Mg = δ is extension of the rod under static loading P ε ∆ the plastic strain range experienced during fatigue loading PK PK PK PK

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“…Cracks in solder balls occur due to thermal coefficient mismatch between the device package and the printed circuit board. The mismatch causes stress on the solder ball and results in cracks in the solder ball [6][7][8][9]. These cracks are cumulative in nature and may develop into fractures over the period of time.…”

Section: Introductionmentioning

confidence: 99%

DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball

et al. 2021

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This paper measures bit error rate degradation in DDR4 due to crack in fine pitch ball grid array (FBGA) package solder ball. Thermal coefficient mismatch between the package and printed circuit board material causes cracks to occur in solder balls. These cracks change the electrical model of the solder ball and introduce parallel capacitance in the electrical model. The capacitance causes higher frequency attenuation and closes the data eye. As the data rate of the DDR4 increases there are more data eye closures. The data eye closure causes bit error rate (BER) degradation as the timing margin and voltage margin decreases. This degradation reduces the reliability of the system and causes more intermittent errors. DDR4 data line is loaded with a parallel capacitive element to mimic a crack in solder ball. The measured data eye shows a decrease in eye width. Bathtub plots are created for comparison of cracked solder ball and intact solder ball. The bathtub plots show the BER degradation due to crack in solder ball.

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Interconnect Reliability Considerations in Portable Consumer Electronic Products

Cited by 5 publications

References 56 publications

DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package

DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package

Robust design of third level packaging in portable electronics: Solder joint reliability under dynamic mechanical loading

DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball

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