Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

Dias, M.V.B.; Costa, Thiago A.; Rocha, Otávio Fernandes Lima da; Spinelli, José Eduardo; Cheung, Noé; Garcia, Amauri

doi:10.1016/j.matchar.2015.05.015

Cited by 43 publications

(37 citation statements)

References 41 publications

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“…It was found in the reflow welding test that the performance of the filaments welded at the peak temperature range was better. More precisely, the peak welding temperature of SAC0307 was about 553.5 K, and its melting point was about 500.5 K. The melting point of Sn90Sb10 was 513.5-518.5 K, and the peak welding temperature of the solder was about 573.5 K [17,18]. Figure 3a shows both the SAC0307-and the Sn90Sb10-welded filaments, with SAC0307 filaments on the left, and Sn90Sb10 filaments on the right.…”

Section: Methodsmentioning

confidence: 99%

Effect of Different Bonding Materials on Flip-Chip LED Filament Properties

et al. 2019

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This article researches the effect of Sn-based solder alloys on flip-chip light-emitting diode LED (FC-LED) filament properties. SEM images, shearing force, steady-state voltage, blue light luminous flux, and junction temperature were examined to demonstrate the difference between two types of FC-LED filaments welded with two solders. The microstructure surface of Sn90Sb10 filament solder joints was smoother and had fewer voids and cracks compared with that of SAC0307 filament solder joints, which indicates that the Sn90Sb10 filaments had a higher shearing force than the SAC0307 filaments; moreover, the average shearing force was beyond 200 gf (standard shearing force). The steady-state voltage and junction temperature of the Sn90Sb10 solder-welded FC-LED filament were lower, and the Sn90Sb10 filament had a relatively higher blue light luminous flux. If high reliability of the solder joints and better photoelectric properties of the filaments are required, this Sn90Sb10 solder is the best bonding material for FC-LED filament welding.

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Section: Methodsmentioning

confidence: 99%

Effect of Different Bonding Materials on Flip-Chip LED Filament Properties

et al. 2019

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“…A Figura 3 ilustra os perfis de taxa de resfriamento (Ṫ) em relação à posição da interface metal/molde para as duas ligas, sendo que, no caso da liga Sn-0,5%Ni (hipereutética), os perfis de Ṫ foram calculados referentes às temperaturas liquidus e eutética, obtendo-se ṪL e ṪE, respectivamente. De imediato, verifica-se que os valores de ṪL são muito superiores às ṪE, indicando que, possivelmente, a maior quantidade de Ni na liga contribui para melhorar a molhabilidade entre o metal líquido e o molde, já que essa diferença é mais significativa nas posições próximas da base [17]. Em relação à ṪE, inicialmente, a liga hipereutética apresenta uma maior taxa de resfriamento em comparação com a liga eutética, e partir da posição 10 mm, os perfis das duas ligas demonstram grande semelhança.…”

Section: Materiais E Métodosunclassified

Solidificação Unidirecional Transitória, Microestrutura E Intermetálicos De Ligas Sn-Ni

Xavier¹,

Cruz²,

Kakitani³

et al. 2017

Anais Do Congresso Anual Da ABM

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Resumo As ligas livres de chumbo (Lead-free solder alloys) potencialmente utilizáveis em processos de soldagem branda, tais como as ligas à base de Sn, vêm sendo estudadas como alternativas para substituir as ligas do sistema Sn-Pb. Em vista disto, o presente trabalho, aborda tanto a análise das características microestruturais formadas durante a solidificação transitória das ligas eutética Sn-0,2%Ni e hipereutética Sn-0,5%Ni, quanto a determinação das suas respectivas correlações com os parâmetros térmicos de solidificação: velocidade da isoterma eutética (VE) e taxa de resfriamento (ṪE). Para tanto, as ligas foram solidificadas unidirecionalmente no sentido vertical ascendente e em regime transiente, e caracterizadas por técnicas de microscopias ótica e eletrônica de varredura. Na liga hipereutética Sn-0,5%Ni, o aumento da quantidade de Ni na liga influenciou tanto o comportamento térmico quanto o espaçamento celular (λC), proporcionando maiores valores de ṪE, porém, λC mais grosseiros.O intermetálico NiSn4 formou-se na região eutética de ambas as ligas, enquanto que na liga Sn-0,5%Ni, as fases primárias identificadas por EDS-MEV foram NiSn4 e Ni3Sn4. A transição morfológica celular/dendrítica(ṪE> 1,2ºC/s) ocorreu apenas para a liga eutética, enquanto que as células regulares da liga hipereutética deram origem as células do tipo placas(ṪE> 1,4ºC/s). Palavras-chave:Ligas livres de chumbo; Solidificação transitória; Microestrutura. TRANSIENT UNIDIRECTIONAL SOLIDIFICATION, MICROSTRUCTURE AND INTERMETALLICS OF SN-NI ALLOYS Abstract Lead-free solder alloys potentially used in soft solder processes, such as Sn-based alloys, have been studied as alternative to Sn-Pb alloys. Therefore, this work aims not only analyze the microstructural features formed during the transient solidification of eutectic Sn-0.2wt.%Ni and hypereutectic Sn-0.5wt.%Ni alloys, but also the determination of their respective correlations with the thermal parameters: growth (VE) and cooling rates (ṪE). The alloys were directionally solidified in upward direction and unsteady-state regime, and characterized by optic and scanning electronic microscopes techniques. Concerning the hypereutectic Sn-0.5wt.%Ni, the increase of Ni content influenced both thermal behavior and cellular spacing (λC), providing higher values of ṪE although λC become more coarse. The NiSn4 intermetallic formed in the eutectic region of both alloys, whilst in the Sn-0.5wt.%Ni, the primary phases identified by EDS-SEM were NiSn4and Ni3Sn4. The morphologic transition cellular/dendritic (ṪE> 1,2ºC/s) occurred only in the eutectic alloy, although regular cells in the hypereutectic alloy turned into plate-like cells (ṪE> 1,4ºC/s).

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“…It is possible that the Sn-Sb solder alloys which have highest melting temperature range among existing lead-free solder alloys, are able to replace the Pb-rich solder alloys [7][8][9][10][11][12][13][14]. It has been reported that the Sn-Sb solder alloys have low electric resistivity and good mechanical properties [7,15].…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens

Kobayashi

Shohji

2019

Metals

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Sn-Sb-Ni solder alloy is expected to be used as a die-attach material for a next-generation power semiconductors in power module. The aim of this paper is to investigate the effects of the Ni content on microstructures, tensile, and fatigue properties of Sn-10Sb-xNi (x = 0.05, 0.10, 0.25, 0.50) (mass%) lead-free solder alloys using miniature size specimens. The Sn-10Sb-Ni solder alloys have the microstructure in which Sb-Sn and Ni-Sb compounds are dispersed in the β-Sn matrix. As the Sb and Ni content increases, Sb-Sn and Ni-Sb compounds are coarsened, respectively. The effect of the Ni content on tensile properties of the alloy is slight at 25 °C. At 150 °C and 200 °C, 0.1% proof stress and tensile strength increase gradually with the Ni content increases, and saturate at the Ni amount over 0.25 mass%. According to the fatigue test at 200 °C, the fatigue properties of Sn-10Sb-Ni with 0.10–0.25 mass% Ni are better than that of the Sn-10Sb. From the experimental results, Sn-10Sb-Ni with 0.10–0.25 mass% Ni have superior mechanical properties.

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Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

Cited by 43 publications

References 41 publications

Effect of Different Bonding Materials on Flip-Chip LED Filament Properties

Effect of Different Bonding Materials on Flip-Chip LED Filament Properties

Solidificação Unidirecional Transitória, Microestrutura E Intermetálicos De Ligas Sn-Ni

Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens

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