2023
DOI: 10.3390/mi14061131
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Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

Abstract: Flexible electronic devices require metal interconnects to facilitate the flow of electrical signals among the device components, ensuring its proper functionality. There are multiple factors to consider when designing metal interconnects for flexible electronics, including their conductivity, flexibility, reliability, and cost. This article provides an overview of recent endeavors to create flexible electronic devices through different metal interconnect approaches, with a focus on materials and structural as… Show more

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Cited by 16 publications
(4 citation statements)
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“…An additional fitting parameter, ε 1 (∞), has been included in Equation ( 4). The dielectric function components ε 1 , ε 2 and layer thickness d were determined using the Spectra Ray 3 software; note that ε 1 + iε 2 = (n + ik) 2 . Surface images taken in situ using an optical microscope during the thermal annealing of the tested samples are shown also in Figure 2.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…An additional fitting parameter, ε 1 (∞), has been included in Equation ( 4). The dielectric function components ε 1 , ε 2 and layer thickness d were determined using the Spectra Ray 3 software; note that ε 1 + iε 2 = (n + ik) 2 . Surface images taken in situ using an optical microscope during the thermal annealing of the tested samples are shown also in Figure 2.…”
Section: Resultsmentioning
confidence: 99%
“…In recent years, functional organic materials and nanostructures have gained great importance, primarily in the production of electronics with advanced electrical and optical properties and flexibility [ 1 , 2 , 3 , 4 ]. Flexible electronic devices, like organic photovoltaic cells (OPV), organic light-emitting diodes (OLED), organic field-effect transistors (OFET) and integrated systems have a high importance for development of computer devices, applicable in such industries as medicine and automotive [ 5 , 6 , 7 , 8 ].…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the (In,Ga)­N materials have the advantages of long lifetime and small size, as well as the direct and tunable band gap . However, the general epitaxial substrates for growing (In,Ga)N materials are rigid, which means that they are quite difficult to be used for preparing flexible devices. , Furthermore, because of withstanding large mechanical deformation under bending conditions, the preparation processes for the flexible monolithic bifunctional device are easily damaged. In general, some conventional integrated devices are often realized by transceiver separation chips, which have some problems such as low efficiency, weak compactness and poor robustness .…”
Section: Introductionmentioning
confidence: 99%
“…A flexible electronic composite film consists of a composite material featuring a metal interconnect layer and a flexible substrate structure [6]. The metal interconnect layer, known for its high elastic modulus and mechanical strength, effectively absorbs most mechanical deformations in practical scenarios [7]. Extensive research conducted by multiple teams has led to the design of various wire structures for the metal interconnect layer-serpentine, linear, horseshoe, and wave, to name a few [8][9][10].…”
Section: Introductionmentioning
confidence: 99%