1977
DOI: 10.2320/matertrans1960.18.835
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Interdiffusion in Cu–Mn Alloys

Abstract: Interdiffusion coefficient, D, in Cu-Mn alloys has been determined by Matano's method in the temperature range between 1021 and 1203 K with the various couples consisting of pure copper and Cu-Mn alloys. It has been found that D increases with manganese content up to 30 at% Mn and decreases remarkably with a further increase of manganese. The concentration dependence of both the activation energy and the frequency factor for interdiffusion shows a small peak at 20 at % Mn and a very large peak at 80 at % Mn; t… Show more

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Cited by 11 publications
(3 citation statements)
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“…262257 s are presented and Kirkendall plane shift of the Cu/Cu-32.6 at.% Mn, Cu/Cu-49.5 at.% Mn, and Cu/Cu-69.6 at.% Mn diffusion couples annealed at 1118 K for different times are shown in Figure 11(b). The calculated results at low Mn content are in good agreement with the experimental result [134]. The apparent divergence shown at high Mn content, 69.6 at.% Mn is due to the fact that Mn is an easy evaporated element.…”
Section: Figuresupporting
confidence: 85%
“…262257 s are presented and Kirkendall plane shift of the Cu/Cu-32.6 at.% Mn, Cu/Cu-49.5 at.% Mn, and Cu/Cu-69.6 at.% Mn diffusion couples annealed at 1118 K for different times are shown in Figure 11(b). The calculated results at low Mn content are in good agreement with the experimental result [134]. The apparent divergence shown at high Mn content, 69.6 at.% Mn is due to the fact that Mn is an easy evaporated element.…”
Section: Figuresupporting
confidence: 85%
“…Manganese was recently shown to be a strongly segregating alloy addition (14) to copper and enriched on the alloy surface and at grain boundaries during annealing. This grain boundary segregation combined with the relatively slow diffusion rate of Mn in Cu (15) promoted the formation of depleted zones adjacent to annealed grain boundaries. During dealloying of an annealed Cu-50%Mn alloy intergranular corrosion occurred.…”
mentioning
confidence: 99%
“…The XPS analysis verifies the presence of Cu­(I) and Cu­(II) and also reveals that the valence state of Fe is a mixture of Fe 2+ /Fe 3+ and the valence state of Mn is dominated by a mixture of Mn­(II), Mn­(III), and Mn­(IV) (Figure S12). The presence of the mixed oxides in the hollow structures could be the result of interdiffusion between Cu and Fe/Mn during the metal-on-metal growth to the corresponding core–shell structures. , It is implied that interdiffusion also plays a role in lowering the interfacial energy for the conformal deposition to the core–shell structures at the nanoscale. Additionally, one explanation for the CuMnO x hollow structures having higher Cu content than the CuFeO x hollow structures is that the bond dissociation energy of Mn–Mn (61 kJ mol –1 ) is lower than that of Fe–Fe (108 kJ mol –1 ), facilitating the interdiffusion during the Cu–MnO x core–shell formation.…”
Section: Resultsmentioning
confidence: 99%