2008
DOI: 10.1049/el:20082905
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Interdigitated terahertz emitters

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Cited by 11 publications
(10 citation statements)
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“…A much simpler technique is preparing an interdigitated electrode pattern similar to the one illustrated in Fig. 1, but instead of evaporating a second metallization layer, trenches are etched into every second gap between the electrodes [68]. In the trenches the bias field is weaker, resulting in THz wavelets that weaken, but do not cancel the contributions from the non-etched areas.…”
Section: Fabrication Techniques For Scalable Microstructured Antennasmentioning
confidence: 99%
“…A much simpler technique is preparing an interdigitated electrode pattern similar to the one illustrated in Fig. 1, but instead of evaporating a second metallization layer, trenches are etched into every second gap between the electrodes [68]. In the trenches the bias field is weaker, resulting in THz wavelets that weaken, but do not cancel the contributions from the non-etched areas.…”
Section: Fabrication Techniques For Scalable Microstructured Antennasmentioning
confidence: 99%
“…1,2 These structures prevent carrier excitation in every second spacing by additional metallization 1,2 or by etching of the substrate. 3,4 Hereby the excited elementary terahertz waves interfere constructively in the far field. These emitter designs combine the advantages of high bias fields and large active areas.…”
Section: Terahertz Emission From a Large-area Gainasn Emittermentioning
confidence: 99%
“…Drawbacks of these sources are the lack of longterm stability, scalability and the low conversion efficiencies from the optical to the THz regime. Further research led to the development of large-area photoconductive emitters [8][9][10], which exhibit one order of magnitude larger conversion efficiency compared to the first sources. Furthermore, recently it has been shown that, with an improved excitation geometry, conversion efficiencies up to 2 × 10 23 are possible [11].…”
mentioning
confidence: 99%