“…It has been widely acknowledged that unique challenges such as solid–solid interfacial issues, cracking of SEs, Li metal penetration through SE, and so on contribute fundamentally to the poor cycle life, limited rate capability, and insufficient capacity retention of the prototype SSLBs, as recently summarized by the excellent works from Shao's group, [ 10 ] Janek's group, [ 11 ] McDowell's group, [ 12 ] Bruce and co‐workers, [ 13 ] Zhang and co‐workers, [ 14 ] Park's group, [ 15 ] Yang's group, [ 16 ] Viswanathan's group, [ 17 ] Meng's group, [ 18 ] Zhao and co‐workers, [ 19 ] and others. [ 20–23 ] Among these challenges, the uncontrollable growth of Li electrodeposits in forms of filaments/needles/dendrites (hereafter the “dendrites” will be used) through the SEs, which is the so‐called Li penetration, poses severe challenge in developing and manufacturing next‐generation SSLBs due to a significant loss of energy efficiency and catastrophic cell failure via short‐circuiting. Hence, addressing this Li penetration bottleneck will not only achieve high‐safety, energy‐dense SSLBs but also accelerate their practical adoptions.…”