Interface-position-dependent structure evolution and mechanical behavior of corrugated cold rolled Cu/Al clad plate: experiment and simulation

Gao, Xiangyu; Bian, Lichun; Zhao, Jingwei; Han, Jianchao; Wang, Tao; Huang, Qingxue

doi:10.1016/j.jmrt.2021.04.049

Cited by 22 publications

(1 citation statement)

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“…기존 방열 모듈 접합은 450 o C 이상의 고온에서 용가재만 녹여 접합하는 브레이징 (Brazing) 공정을 통해 진행하였다 [9]. 최근에는 450 o C 이 하의 저온에서 클래딩(Cladding)과 솔더링(Soldering) 공정 을 통해 Cu와 Al을 직접 접합하여 Cu와 Al의 장점을 모 두 갖는 Cu/솔더/Al 구조의 방열 모듈이 각광받고 있다 [13][14][15][16]. Cu, Al의 솔더링 공정에 사용되는 솔더의 경우 좋은 젖음성과 접합부신뢰성을 가진 3원계의 Sn-3.0Ag-0.5Cu(SAC305) 솔더 또는 2원계의 Sn-Cu계, Sn-Ag계 솔 더가 주로 사용된다 [17][18][19][20][21]…”

Section: 대한금속 • 재료학회지 제62권 제4호 (2024년 4월)unclassified

Effects of Post-annealing Condition on Interfacial Reaction and Bonding Strength of Cu/Sn-3.0Ag-0.5Cu/Al Joint for Heat Dissipation Module Application

Jeong,

Kim,

Kim

et al. 2024

Korean J. Met. Mater.

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The effects of post-annealing times at 150°C on the bonding strength and interfacial characteristics of Cu/Sn-3.0Ag-0.5Cu (SAC305)/Al were systematically evaluated. In the as-bonded sample, Cu6Sn5 intermetallic compound (IMC) was formed at the upper Cu/SAC305 interface, while Ag3Al IMC was formed at the lower SAC305/Al interface, and a black layer of Al2Cu IMC was formed at a distance of about 20 µm from the Al interface. The Al atoms from the Al pad diffused towards the SAC305 solder during the bonding process and reacted with Cu to form the Al2Cu IMC. After post-annealing for 500 h at 150°C, the growth of Cu-Sn and Al2Cu IMCs followed a linear relationship with the square root of the annealing time, which could be understood by a diffusion-dominant mechanism. To measure the bonding strength, the lap shear test was evaluated on the Cu/SAC305/Al structure with time during post-annealing at 150°C. Initial bonding strength of around 118.80 MPa decreased to 92.4MPa after post-annealing for 200h, and then remained constant until 500 h. And the fracture locus was the mixed mode of SAC305/Al2Cu interface and cohesive inside SAC305 solder. Also, when the post-annealing time was increased from 150 h to 200 h, the fracture toughness decreased sharply from 438 J/m3 to 100 J/m3. This decrease seems to be closely related to an increase in the SAC305/Al2Cu interface fracture mode. This is believed to be due to the increase in the SAC305/Al2Cu interface fracture mode due to the growth of the Al2Cu layer thickness.

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