2020
DOI: 10.1002/smll.202000714
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Interface‐Strengthened Polymer Nanocomposites with Reduced Dielectric Relaxation Exhibit High Energy Density at Elevated Temperatures Utilizing a Facile Dual Crosslinked Network

Abstract: High‐temperature ceramic/polymer nanocomposites with large energy density as the reinforcement exhibit great potential for energy storage applications in modern electronic and electrical power systems. Yet, a general drawback is that the increased dielectric constant is usually achieved at the cost of decreased breakdown strength, thus leading to moderate improvement of energy density and even displaying a marked deterioration under high temperatures and high electric fields. Herein, a new strategy is reported… Show more

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Cited by 73 publications
(51 citation statements)
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“…[47,39] Figure 4b shows the relationship between electrical conductivity and PEEKt film thickness at room temperature and 1000 Hz, which shows the conductivity of the 75 μm-PEEK/PANI film reaching the maximum. [69][70][71] As the thickness increases to 75 μm, the aniline on the outside of the film diffuses into the solution, but the aniline on the inside is restricted to the inside of the film due to diffusion hindered, and the formed PANI gradually aggregates into a conductive path, and the conductivity increases. The conductivity of the 75 μm-PANI/PEEK film reaches a maximum of 3.01×10 −4 S m −1 .…”
Section: Dielectric and Conductive Properties Of Pani/peek Filmmentioning
confidence: 99%
“…[47,39] Figure 4b shows the relationship between electrical conductivity and PEEKt film thickness at room temperature and 1000 Hz, which shows the conductivity of the 75 μm-PEEK/PANI film reaching the maximum. [69][70][71] As the thickness increases to 75 μm, the aniline on the outside of the film diffuses into the solution, but the aniline on the inside is restricted to the inside of the film due to diffusion hindered, and the formed PANI gradually aggregates into a conductive path, and the conductivity increases. The conductivity of the 75 μm-PANI/PEEK film reaches a maximum of 3.01×10 −4 S m −1 .…”
Section: Dielectric and Conductive Properties Of Pani/peek Filmmentioning
confidence: 99%
“…where P is the cumulative probability corresponding to the dielectric breakdown, α is the characteristic breakdown strength of 63.2% failure probability, and β is a shape parameter to evaluate the dispersion of data. 6,45 A linear fit was used to calculate the characteristic E b , and each characteristic curve of this linear fit corresponds to 15 specimens per sample. As shown in Figure 6a, compared with PP, PP/PP-g-MAH blend shows higher breakdown strength, which increases from 327 MV/m of PP to 375 MV/m of PP/PP-g-MAH.…”
Section: Weibull Distribution Of Breakdown Strengthmentioning
confidence: 99%
“…To minimize both, the surface functionalization of the nanofillers becomes essential for homogeneous dispersion and interfacial properties. [5][6][7][8][9] The researchers have used polydopamine (PDA), 10,11 polyurea, 12 fluoropolymers, 13,14 silicon dioxide (SiO 2 ), 15 polyvinylpyrrolidone (PVP), 16,17 and so forth. Besides dielectrics, polymer nanocomposites also have extensive applications in piezoelectrics, triboelectric, biomedical, and food packaging.…”
Section: Introductionmentioning
confidence: 99%