well drilling. [1][2][3] Nowadays, dielectric materials with excellent high-temperature capacitive properties are in great demand because of the heat inevitably generated by compact high-power electronic systems. [4][5][6][7] For example, the operating temperature of capacitors is 140-150 °C in green-energy vehicle inverters and reaches 200 °C in electrified aircraft. Biaxially oriented polypropylene (BOPP), the mainstream commercial polymer dielectrics, has discharged energy densities (U e ) <4.0 J cm −3 and a maximum operating temperature below 105 °C. [5,8,9] Therefore, developing dielectric polymers with high working temperatures and large energy storage densities is of critical importance.The current high glass-transitiontemperature (T g ) dielectric polymers, including polyimide (PI), polyetherimide (PEI), polyetheretherketone (PEEK), and fluorene polyester (FPE), usually exhibit low breakdown strength (E b ) and poor capacitive performance at >150 °C because of an exponential increase in conduction loss with the applied field and temperature. [5,10,11] There are two types of conduction mechanisms in dielectrics, i.e., electrode-limited and bulk-limited conduction mechanisms. [6,[12][13][14][15][16][17] Unlike the electrode-limited conduction mechanism that depends on the electrode-dielectric interface, the bulk-limited conduction mechanism is determined by the electrical characteristics High-temperature polymer dielectrics have broad application prospects in next-generation microelectronics and electrical power systems. However, the capacitive energy densities of dielectric polymers at elevated temperatures are severely limited by carrier excitation and transport. Herein, a molecular engineering strategy is presented to regulate the bulk-limited conduction in the polymer by bonding amino polyhedral oligomeric silsesquioxane (NH 2 -POSS) with the chain ends of polyimide (PI). Experimental studies and density functional theory (DFT) calculations demonstrate that the terminal group NH 2 -POSS with a wide-bandgap of E g ≈ 6.6 eV increases the band energy levels of the PI and induces the formation of local deep traps in the hybrid films, which significantly restrains carrier transport. At 200 °C, the hybrid film exhibits concurrently an ultrahigh discharged energy density of 3.45 J cm −3 and a high gravimetric energy density of 2.74 J g −1 , with the charge-discharge efficiency >90%, far exceeding those achieved in the dielectric polymers and nearly all other polymer nanocomposites. Moreover, the NH 2 -POSS terminated PI film exhibits excellent charge-discharge cyclability (>50000) and power density (0.39 MW cm −3 ) at 200 °C, making it a promising candidate for high-temperature high-energy-density capacitors. This work represents a novel strategy to scalable polymer dielectrics with superior capacitive performance operating in harsh environments.