Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior

Abstract

We have proposed a novel bonding process using silver nanoparticles, which can be alternative to lead-rich high melting point solders. The bonding mechanism of silver metallo-organic nanoparticles to bulk materials (gold and copper) is discussed based on the observations of the bonded interface using Transmission Electron Microscope (TEM). At the interface of sintered silver and bulk gold, the crystal orientation of silver corresponded to that of gold. It is thought that the epitaxial layer of silver formed through silver nanoparticles being oriented in the direction of the gold crystal. At the interface of sintered silver and bulk copper, no epitaxial layer of silver on the copper crystal formed. Though the appearance of the crystal structure of silver/copper interface is different from that of the silver/gold interface, copper as well as gold are coherent with silver, and have been successfully bonded using the silver nanoparticles.

Bonding Technique Using Micro-Scaled Silver-Oxide Particles for <I>In-Situ</I> Formation of Silver Nanoparticles

“…7(e). Given that fact, we consider that we achieved an effect similar to the nanoparticle bonding previously reported [6][7][8]10,11) by forming the nanoparticles during the reduction of silver oxide. Figure 10 shows TEM images of the interface between the plating film and the silver sintering layer of each of the specimens observed in Fig.…”

Interfacial Bonding Behavior between Silver Nanoparticles and Gold Substrate Using Molecular Dynamics Simulation

“…20) The simulated temperature was set to 523 K for comparison with our experimental result. 13) The cross section of a typical model of a silver nanoparticle and a gold substrate is shown in Fig. 2.…”

“…We have previously observed the silver/gold interface bonded at 523 K under a bonding pressure of 5 MPa using metallo-organic nanoparticles 13) and identified that the sintered silver atoms were crystallographically oriented to the gold substrate, as shown in Fig. 1.…”

Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste

“…Furthermore, the sintering behavior of metallic nanoparticles has been exploited to write electronic circuits and join components to substrate [15][16][17][18][19][20]. For example, Ide et al [16] reported achieving Cu-to-Cu joining using Ag metallo-organic nanoparticles at a low bonding temperature (573 K) and a bonding pressure of 1 or 5 MPa; the shear strength of the resulting joints was 25-40 MPa.…”