Interfacial characterization and thermal conductivity of diamond/Cu composites prepared by two HPHT techniques

Chen, Hui; Jia, Chengchang; Shang-Jie, Li

doi:10.1007/s10853-011-6180-6

Cited by 31 publications

(7 citation statements)

References 27 publications

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“…The most studied materials for thermal application are usually composed by an aluminium or copper matrix -due to their high thermal conductivity -or iron -due to the large usage of iron and its alloys as raw material for mechanical system parts [1][2][3][4][5] . Silicon carbide and diamond are widely used as additives, having high thermal conductivity and low thermal expansion that improve the dimensional stability of these composites [6][7][8][9][10] . Parts that overheat during its operation in mechanical systems intensify the energy losses in these systems.…”

Section: Introductionmentioning

confidence: 99%

Effect of Microstructure on the Thermal Properties of Sintered Iron-copper Composites

et al. 2015

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Copper is a well know material for use as heat sink or heat exchanger. However, copper has a considerable low tensile strength and temperature limit. A material that has a good thermal conductivity, low cost, but also resistance is the desired. Effects of copper on the sintering and thermal properties of iron-copper composites produced by powder metallurgy and Fe on copper-iron composites have been investigated. Copper and iron were varied from 20 to 80 vol.% in the samples, alternating the continuous phase. Sintering studies were performed by in-situ dilatometry aiming to define the proper conditions for sintering, without swelling normally associated with copper. Results indicate that the type of sintering, final microstructure, specially the phases relation and distribution and not only the amount of copper, have a great effect into the thermal properties. By controlling the sintering parameters, it is possible to obtain dimensionally stable samples with higher thermal conductivity and lower copper amount.

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Section: Introductionmentioning

confidence: 99%

Effect of Microstructure on the Thermal Properties of Sintered Iron-copper Composites

et al. 2015

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“…This is because an amorphous carbon layer is formed on the diamond surfaces under such conditions in the HTHP infiltration method, but is not formed by the PM method. The pure amorphous carbon interface layer helps enhance the bonding between copper and diamond particles [53]. The interface characteristics of the samples produced using this method are not well investigated, comparing with that we reviewed above.…”

Section: High-temperature High-pressure Methodsmentioning

confidence: 90%

High thermal conductive copper/diamond composites: state of the art

Jia

Yang

2020

J Mater Sci

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Copper/diamond composites have drawn lots of attention in the last few decades, due to its potential high thermal conductivity and promising applications in high-power electronic devices. However, the bottlenecks for their practical application are high manufacturing/machining cost and uncontrollable thermal performance affected by the interface characteristics, and the interface thermal conductance mechanisms are still unclear. In this paper, we reviewed the recent research works carried out on this topic, and this primarily includes (1) evaluating the commonly acknowledged principles for acquiring high thermal conductivity of copper/diamond composites that are produced by different processing methods; (2) addressing the factors that influence the thermal conductivity of copper/diamond composites; and (3) elaborating the interface thermal conductance problem to increase the understanding of thermal transferring mechanisms in the boundary area and provide necessary guidance for future designing the composite interface structure. The links between the composite’s interface thermal conductance and thermal conductivity, which are built quantitatively via the developed models, were also reviewed in the last part.

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“…Schubert et al [9] studied a composite produced by hot pressing sintering that possessed a TC of 215 W m −1 K −1 . Additionally, Chen et al [10] illustrated that the obtained composites exhibited TC values as low as 200 W m −1 K −1 by a high-pressure high-temperature powder metallurgy (HPHT-PM) method. Sang et al [11] produced a low TC (approximately 114 W m −1 K −1 ) for an uncoated diamond/copper composite fabricated by an infiltration method.…”

Section: Introductionmentioning

confidence: 99%

The Interface and Fabrication Process of Diamond/Cu Composites with Nanocoated Diamond for Heat Sink Applications

Zhou

et al. 2021

Metals

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The coefficients of thermal expansion (CTE) and thermal conductivity (TC) are important for heat sink applications, as they can minimize stress between heat sink substrates and chips and prevent failure from thermal accumulation in electronics. We investigated the interface behavior and manufacturing of diamond/Cu composites and found that they have much lower TCs than copper due to their low densities. Most defects, such as cavities, form around diamond particles, substantially decreasing the high TC of diamond reinforcements. However, the measurement results for the Cu-coated diamond/Cu composites are unsatisfactory because the nanosized copper layer on the diamond surface grew and spheroidized at elevated sintering temperatures. Realizing ideal interfacial bonding between a copper matrix and diamond particles is difficult. The TC of the 40 vol.% Ti-coated diamond/Cu composite is 475.01 W m−1 K−1, much higher than that of diamond/Cu and Cu-coated diamond/Cu composites under equivalent manufacturing conditions. The minimally grown titanium layer retained its nanosized and was consistent with the sintering temperature. Depositing a nanosized titanium layer on a diamond surface will strengthen interfacial bonding through interface reactions among the copper matrix, nanosized titanium layer and diamond particles, reducing the interfacial thermal resistance and exploiting the high TC of diamond particles, even if defects from powder metallurgy remain. These results provide an important experimental and theoretical basis for manufacturing diamond/Cu composites for heat sink applications.

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Interfacial characterization and thermal conductivity of diamond/Cu composites prepared by two HPHT techniques

Cited by 31 publications

References 27 publications

Effect of Microstructure on the Thermal Properties of Sintered Iron-copper Composites

Effect of Microstructure on the Thermal Properties of Sintered Iron-copper Composites

High thermal conductive copper/diamond composites: state of the art

The Interface and Fabrication Process of Diamond/Cu Composites with Nanocoated Diamond for Heat Sink Applications

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