2003
DOI: 10.1016/s0169-4332(03)00679-2
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Interfacial composition and electrical properties of PtSi/Si1−xGex/Si diodes by molecular beam epitaxy (MBE) and pulsed laser deposition (PLD)

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Cited by 2 publications
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“…Because detecting UVC requires wide bandgap semiconductors as the photosensitive layer, UVC PDs are mainly made from ultra-wide bandgap semiconductors (UWBG), such as gallium oxide (Ga 2 O 3 ), aluminum nitride (AlN), boron nitride (BN), and magnesium-doped zinc oxide (MgZnO) [1,[9][10][11][12]. However, the fabrications of UVC PDs using the above UWBG materials all require complex fabrication processes with a high temperature, such as chemical vapor deposition (CVD) [11,13] and molecular beam epitaxy (MBE) [14]. Thus, a UWBG functional material based on a low-temperature process is highly required.…”
Section: Introductionmentioning
confidence: 99%
“…Because detecting UVC requires wide bandgap semiconductors as the photosensitive layer, UVC PDs are mainly made from ultra-wide bandgap semiconductors (UWBG), such as gallium oxide (Ga 2 O 3 ), aluminum nitride (AlN), boron nitride (BN), and magnesium-doped zinc oxide (MgZnO) [1,[9][10][11][12]. However, the fabrications of UVC PDs using the above UWBG materials all require complex fabrication processes with a high temperature, such as chemical vapor deposition (CVD) [11,13] and molecular beam epitaxy (MBE) [14]. Thus, a UWBG functional material based on a low-temperature process is highly required.…”
Section: Introductionmentioning
confidence: 99%